收藏切换
Synthesis and performance characterization of h-BN/PI high thermal conductive composites
收藏切换
PDF
Jie LIU, Jun YANG, Qian JIANG, Jiang XU, Jiming GAO, Haiyang YANG, Anmin HUANG, Jin WANG
Insulating Materials | 2025, 58(5) : 49 - 54
Less
收藏切换
Insulating Materials | 2025, 58(5): 49-54
Material Research
Synthesis and performance characterization of h-BN/PI high thermal conductive composites
Full
Jie LIU, Jun YANG, Qian JIANG, Jiang XU, Jiming GAO, Haiyang YANG, Anmin HUANG, Jin WANG
Affiliations
  • Zhuzhou Times New Material Technology Co., Ltd., Zhuzhou 412007, China
Published: 2025-05-20 doi: 10.16790/j.cnki.1009-9239.im.2025.05.007
Outline
收藏切换

To solve the problem of poor thermal conductivity of polyimide (PI), PI was doped with hexagonal boron nitride (h-BN) modified by a surface wetting agent (F068) through in-situ polymerization, and then a series of h-BN/PI high thermal conductivity composites were prepared. The structure of h-BN/PI composites was characterized by Fourier transform infrared spectroscopy and scanning electron microscopy. The thermal conductivity mechanism of h-BN/PI composites was explored by introducing the Y.Agari model, and the influence of modified h-BN filler doping content on the thermal conductivity, mechanical, heat resistance, and insulating properties of the composites was analyzed. The results show that with the increase of modified h-BN doping content, the thermal conductivity and thermal stability of h-BN/PI composites increase, while their tensile strength, elongation at break, and electric strength exhibit a significant downward trend. When the doping amount of modified h-BN is less than 30%, the influence of polymer crystal size factor on the thermal conductivity of the composites is dominant. When the doping amount of modified h-BN is higher than 30%, the influence of the free factor of the thermal chain formed by thermal conductive particles on the thermal conductivity of the composites is dominant. When the doping amount of modified h-BN is 50%, the thermal conductivity of h-BN/PI composite reaches 0.83 W/(m·K), the electric strength is 198.6 kV/mm, the 5% thermal decomposition temperature is 595℃, the tensile strength is 64.8 MPa, and the elongation at break is 10.4%.

in-situ polymerization  /  polyimide  /  thermal conductivity  /  hexagonal boron nitride  /  surface wetting agents
Jie LIU, Jun YANG, Qian JIANG, Jiang XU, Jiming GAO, Haiyang YANG, Anmin HUANG, Jin WANG. Synthesis and performance characterization of h-BN/PI high thermal conductive composites[J]. Insulating Materials, 2025 , 58 (5) : 49 -54 . DOI: 10.16790/j.cnki.1009-9239.im.2025.05.007
Year 2025 volume 58 Issue 5
PDF
367
172
Cite this Article
BibTeX
Article Info
doi: 10.16790/j.cnki.1009-9239.im.2025.05.007
  • Receive Date:2024-08-13
  • Online Date:2025-12-04
  • Published:2025-05-20
Article Data
Affiliations
History
  • Received:2024-08-13
  • Revised:2024-11-05
Funding
Affiliations
    Zhuzhou Times New Material Technology Co., Ltd., Zhuzhou 412007, China
References
Share
https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2025.05.007
Share to
QR

Scan QR to access full text

Cite this article
BibTeX
Citations
表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
  • BibTeX
  • EndNote
  • RefWorks
  • TxT