Home Journals Articles Updates About
CN
image
收藏切换
Progress of thermal conductive silicone composites for electronic packaging
收藏切换
Lüe XIANG1, 2, Yeqin ZHANG1, 2, Yuqiang BAO1, 2, Zhe WANG1, 2, Yunran WANG1, 2, Yunzhong MAO1, 2, Yuanjian ZHOU1, 2
Insulating Materials | 2023, 56(7) : 9 - 15
Less
收藏切换
Insulating Materials | 2023, 56(7): 9-15
• Review •
Progress of thermal conductive silicone composites for electronic packaging
Full
Lüe XIANG1, 2, Yeqin ZHANG1, 2, Yuqiang BAO1, 2, Zhe WANG1, 2, Yunran WANG1, 2, Yunzhong MAO1, 2, Yuanjian ZHOU1, 2
Affiliations
  • 1China Bluestar Chengrand Co., Ltd., Chengdu 610041, China
  • 2National Silicone Engineering Technology Research Center, Chengdu 610041, China
Published: 2023-07-20 doi: 10.16790/j.cnki.1009-9239.im.2023.07.002
Outline
收藏切换

The thermal conductivity mechanism and common thermal conductive fillers of thermal conductive silicone composites for electronic packaging were presented, the preparation strategies and research progress of filled-type high thermal conductive silicone composites were reviewed, and the future research direction of thermal conductive silicone composites for electronic packaging was prospected.

silicone  /  electronic packaging  /  composite  /  thermal conductivity  /  filled-type polymer
向略, 张叶琴, 暴玉强, 王哲, 王韵然, 毛云忠, 周远建. 电子封装用导热有机硅复合材料的研究进展. 绝缘材料, 2023 , 56 (7) : 9 -15 . DOI: 10.16790/j.cnki.1009-9239.im.2023.07.002
Lüe XIANG, Yeqin ZHANG, Yuqiang BAO, Zhe WANG, Yunran WANG, Yunzhong MAO, Yuanjian ZHOU. Progress of thermal conductive silicone composites for electronic packaging[J]. Insulating Materials, 2023 , 56 (7) : 9 -15 . DOI: 10.16790/j.cnki.1009-9239.im.2023.07.002
Appendix
Less
Year 2023 volume 56 Issue 7
935
455
Cite this Article
BibTeX
Article Info
doi: 10.16790/j.cnki.1009-9239.im.2023.07.002
  • Receive Date：2022-10-11
  • Online Date：2025-11-24
  • Published：2023-07-20
Article Data
Affiliations
History
  • Received：2022-10-11
  • Revised：2022-11-18
Affiliations
    1China Bluestar Chengrand Co., Ltd., Chengdu 610041, China
    2National Silicone Engineering Technology Research Center, Chengdu 610041, China
References
Share
https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2023.07.002
Share to
QR

Scan QR to access full text

Cite this article
BibTeX
Citations
表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
  • BibTeX
  • EndNote
  • RefWorks
  • TxT
Links
Articles
Latest Articles
Most Read
Collections
Updates
Events
News
Multimedia
About
About Us
Contact
No. 86 Xueyuan South Road, Haidian District, Beijing
100081
010-62662699(Operation and Technical Support)
qkjq@cast.org.cn

Copyright © 2025 China Association for Science and Technology. All rights reserved. For all open access content, the relevant licensing terms apply.
Sponsored by the Office of the Leading Group for Cybersecurity and Informatization of CAST, and supported by Science and Technology Review Publishing House