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Temperature resistance of organic silicone encapsulant used in silicone carbide power devices
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Ying LIN1, Yulong SHI1, Yuhao LIU2, Yunxiao ZHANG2, Boya ZHANG3, Tao WEN1
Insulating Materials | 2023, 56(12) : 24 - 33
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Insulating Materials | 2023, 56(12): 24-33
• Advanced Electrical Materials for Large Capacity Offshore Wind Power Transmission •
Temperature resistance of organic silicone encapsulant used in silicone carbide power devices
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Ying LIN1, Yulong SHI1, Yuhao LIU2, Yunxiao ZHANG2, Boya ZHANG3, Tao WEN1
Affiliations
  • 1School of Electrical and Automation Engineering, Hefei University of Technology, Hefei 230009, China
  • 2College of Electrical Engineering and Automation, Fuzhou University, Fuzhou 350108, China
  • 3Xi′an Jiaotong University, Xi′an 710049, China
Published: 2023-12-20 doi: 10.16790/j.cnki.1009-9239.im.2023.12.004
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The high power density development and application demand in aerospace field of silicone carbide (SiC) power modules have proposed higher requirements for the high and low temperature resistance of organic silicone encapsulation materials used in modules packaging. In this paper, the temperature resistance of three silicone encapsulants (SEMICOSIL 915HT, Duraseal 1533, R-2188) was compared. The results show that the reaction in the methyl oxidation stage during the thermal degradation process is the same as the early reaction in the thermal oxygen ageing process of silicone encapsulants. The R-2188 encapsulant has 249.5 kJ/mol of highest activation energy for methyl oxidation reaction, 335℃ of initial thermal decomposition temperature, and 5% of lower mass loss during the methyl oxidation stage, which is more suitable for the packaging of SiC power module under high-temperature operating conditions. The SEMICOSIL 915HT encapsulant has -81.1℃ of initial crystallization temperature and 0.006 4 min-1 of crystallization rate, which is more suitable for the packaging of SiC power module under low-temperature operating conditions.

organic silicone encapsulant  /  silicone carbide power modules  /  encapsulation  /  temperature resistance
Ying LIN, Yulong SHI, Yuhao LIU, Yunxiao ZHANG, Boya ZHANG, Tao WEN. Temperature resistance of organic silicone encapsulant used in silicone carbide power devices[J]. Insulating Materials, 2023 , 56 (12) : 24 -33 . DOI: 10.16790/j.cnki.1009-9239.im.2023.12.004
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doi: 10.16790/j.cnki.1009-9239.im.2023.12.004
  • Receive Date：2025-05-25
  • Online Date：2025-11-24
  • Published：2023-12-20
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  • Received：2025-05-25
  • Revised：2023-07-17
Affiliations
    1School of Electrical and Automation Engineering, Hefei University of Technology, Hefei 230009, China
    2College of Electrical Engineering and Automation, Fuzhou University, Fuzhou 350108, China
    3Xi′an Jiaotong University, Xi′an 710049, China
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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