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Moisture condition evaluation of epoxy resin impregnated crepe paper based on frequency domain spectroscopy
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Yang JIANG1, He ZHAO2, Yifan SONG2, Yongwen SUN3
Insulating Materials | 2023, 56(7) : 60 - 66
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Insulating Materials | 2023, 56(7): 60-66
Insulation Technology
Moisture condition evaluation of epoxy resin impregnated crepe paper based on frequency domain spectroscopy
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Yang JIANG1, He ZHAO2, Yifan SONG2, Yongwen SUN3
Affiliations
  • 1State Grid Beijing Electric Power Company, Beijing 100031, China
  • 2State Grid Beijing Electric Power Research Institute, Beijing 100075, China
  • 3Beijing Crehoi Sci & Thch Co., Ltd., Beijing 100161, China
Published: 2023-07-20 doi: 10.16790/j.cnki.1009-9239.im.2023.07.010
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Epoxy resin impregnated crepe paper (ERICP) insulating materials are widely used in power equipment insulation, and moisture is an important reason affecting their insulation state. In this paper, the frequency domain spectroscopy (FDS) technology was used for insulation condition evaluation. Firstly, ERICP samples with different moisture content were prepared and carried out FDS tests. Then, according to the FDS spectrum curves, the variation law of FDS characteristic parameters with moisture content was analyzed. Finally, the dielectric modulus spectrum and modulus factor were introduced, and the insulation condition evaluation method of ERICP was proposed. The results show that the change of moisture content affects the overall change law of FDS curves. The dielectric modulus can effectively suppress the influence of DC conductivity to characterize the internal relaxation process. The dielectric modulus spectrum of ERICP samples has obvious relaxation peak in the low-frequency range, and the characteristic frequency of relaxation peak increases with the increase of moisture content. The integral area of the imaginary part of dielectric modulus can be used as a characteristic parameter to characterize the insulation condition of ERICP. The relationship between the modulus factor and moisture content has 0.997 5 of goodness of fit with the exponential function.

epoxy resin impregnated crepe paper  /  moisture content  /  frequency domain spectroscopy  /  dielectric modulus  /  modulus factor
Yang JIANG, He ZHAO, Yifan SONG, Yongwen SUN. Moisture condition evaluation of epoxy resin impregnated crepe paper based on frequency domain spectroscopy[J]. Insulating Materials, 2023 , 56 (7) : 60 -66 . DOI: 10.16790/j.cnki.1009-9239.im.2023.07.010
Year 2023 volume 56 Issue 7
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2023.07.010
  • Receive Date:2022-07-20
  • Online Date:2025-11-24
  • Published:2023-07-20
Article Data
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History
  • Received:2022-07-20
  • Revised:2022-10-08
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Affiliations
    1State Grid Beijing Electric Power Company, Beijing 100031, China
    2State Grid Beijing Electric Power Research Institute, Beijing 100075, China
    3Beijing Crehoi Sci & Thch Co., Ltd., Beijing 100161, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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