Epoxy resin is used as the main material for insulated packaging of electronic device and motors, it is urgent to improve its thermal conductivity to meet more demanding use requirements. In this research, epoxy resin was modified by filling irregular alumina (i-Al2O3), and the effects of irregular i-Al2O3 with different volume fraction on the thermal conductivity and other properties of EP were studied. The results show that with the increase of the mass fraction of i-Al2O3, the viscosity of the composite mixing system gradually increases, the tensile strength increases at first and then decreases, the thermal stability and thermal conductivity gradually increase. When the volume fraction of i-Al2O3 is 45%, the epoxy composite material shows good the overall performance, its thermal conductivity coefficient reaches to 1.44 W/(m·K), which is 585.7% higher than that of pure epoxy resin with the thermal conductivity of 0.21 W/(m·K), at the same time, the volume resistance of the composite remains at the 1014 Ω·cm quantitative level.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |