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Epoxy resin micro-alumina composite materials with micro-alumina mass fraction of 0, 20%, and 40% were prepared. The effect of micro-alumina filler on the dielectric relaxion behavior of epoxy resin at high temperature was analyzed by dielectric test at room temperature and high temperature and fitting calculation of high temperature dielectric spectra. The results show that the effect of micro-alumina on the dielectric relaxion at high temperature is more obviously than that at room temperature. With the introduction of alumina, the optical frequency dielectric constant increases, while the relaxation strength of relaxion process α shows little change. With the increase of mass fraction of filler, the relaxion time of relaxion process α decreases. Besides, the micro-alumina filler significantly increases the relaxion strength of relaxation process δ. However, with the increase of mass fraction of micro-alumina, the relaxation strength of relaxation process δ decreases, while the relaxation time increases continuously.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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