PDF
Full
Outline
The extrusion process technology of semi-conductive shielding material (SCSM) for high-voltage cables is crucial for the uniform dispersion and distribution of conductive carbon black (CB), as well as the interfacial interaction between CB and matrix resin. To investigate the influence of processing methods and parameters on the structure and properties of SCSM, this study employed twin-screw extrusion granulation and single-screw extrusion sheet processes. The influence of extrusion temperature, screw speed on the microstructure, electrical properties, mechanical properties, and surface smoothness of the SCSM were investigated. The results show that the optimal parameters for the twin-screw extrusion granulation process are 160℃ of extrusion temperature and 120 r/min of screw speed. Under these conditions, the volume resistivity of the shielding material at 23℃ and 90℃ is 9.6 Ω·cm and 265.0 Ω·cm, respectively. In the single-screw extrusion sheet process, when the extrusion temperature and screw speed are 105℃ and 50 r/min, respectively, the CB achieves sufficient shear force and dispersion time, effectively preventing pre-crosslinking of the SCSM. Consequently, there is no protrusions larger than 50 μm in diameter observed on the surface of the shielding material.
PDF
100
46
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
关闭全屏
No. 86 Xueyuan South Road, Haidian District, Beijing
010-62199257
qkjq@cast.org.cn
Copyright © 2025 China Association for Science and Technology. All rights reserved. For all open access content, the relevant licensing terms apply.
Sponsored by the Office of the Leading Group for Cybersecurity and Informatization of CAST, and supported by Science and Technology Review Publishing House
