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Effect of thermal-cooling cycling on electrical properties of epoxy resin
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Yuanxiang ZHOU1, 2, Jingfan XU1, Xiaoqian ZHU2, Xuanhao LIU1, Yi LU3, Yanfeng GAO3
Insulating Materials | 2025, 58(2) : 92 - 101
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Insulating Materials | 2025, 58(2): 92-101
• Test and Analysis •
Effect of thermal-cooling cycling on electrical properties of epoxy resin
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Yuanxiang ZHOU1, 2, Jingfan XU1, Xiaoqian ZHU2, Xuanhao LIU1, Yi LU3, Yanfeng GAO3
Affiliations
  • 1The Wind Solar Storage Division of State Key Laboratory of Control and Simulation of Power System and Generation Equipment, School of Electrical Engineering, Xinjiang University, Urumqi 830047, China
  • 2State Key Laboratory of Control and Simulation of Power Systems and Generation Equipment, Department of Electrical Engineering, Tsinghua University, Beijing 100084, China
  • 3Research Institute of State Grid Jibei Electric Power Co., Ltd., Beijing 100045, China
Published: 2025-02-20 doi: 10.16790/j.cnki.1009-9239.im.2025.02.013
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The influence mechanism of thermal-cooling cycling times and temperature change rate on the electrical properties of epoxy resin were studied using a linear rising and cooling method. The results show that as the cycle times increases, the DC electric strength and volume resistivity of epoxy resin increase at first and then decrease, and this trend slightly increases in early cycles with the increase of temperature change rate, but decreases significantly in later cycles. The analysis indicates that thermal and cold alternating environment will promote the dynamic adjustment of chain segments in epoxy resin, making its structure more compact and regular. Although thermal expansion and cold contraction may cause micro-cracks appear on the surface of epoxy resin during early cycles, dynamic adjustment plays a dominant role, which leads to the improvment of electrical properties of epoxy resin. However, with the increase of cycle times, long-term thermal expansion and cold contraction intensifies the fracture of molecular chain segments and the expansion of micro-crack, resulting in the decrease of electrical properties of epoxy resin. With the increase of temperature change rates, the internal chain segment in epoxy resin cannot be fully adjusted, and the impact of temperature stress increases, which lead the epoxy resin more prone to deterioration.

thermal-cooling cycling  /  epoxy resin  /  linear thermal-cooling  /  temperature change rate  /  electrical properties
Yuanxiang ZHOU, Jingfan XU, Xiaoqian ZHU, Xuanhao LIU, Yi LU, Yanfeng GAO. Effect of thermal-cooling cycling on electrical properties of epoxy resin[J]. Insulating Materials, 2025 , 58 (2) : 92 -101 . DOI: 10.16790/j.cnki.1009-9239.im.2025.02.013
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2025.02.013
  • Receive Date：2024-01-17
  • Online Date：2025-11-06
  • Published：2025-02-20
Article Data
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History
  • Received：2024-01-17
  • Revised：2024-03-27
Funding
Affiliations
    1The Wind Solar Storage Division of State Key Laboratory of Control and Simulation of Power System and Generation Equipment, School of Electrical Engineering, Xinjiang University, Urumqi 830047, China
    2State Key Laboratory of Control and Simulation of Power Systems and Generation Equipment, Department of Electrical Engineering, Tsinghua University, Beijing 100084, China
    3Research Institute of State Grid Jibei Electric Power Co., Ltd., Beijing 100045, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2025.02.013
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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