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Ultrasonic detection of epoxy/silicone rubber interface stress under extreme cold conditions
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Yan Li1, Yan Li1, Yuyao Zhong1, Xiaobin Hu1, Lingyuan Lan1, Chunbo Liu2
Insulating Materials | 2026, 59(7) : 131 - 140
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Insulating Materials | 2026, 59(7): 131-140
Test and Analysis
Ultrasonic detection of epoxy/silicone rubber interface stress under extreme cold conditions
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Yan Li1, Yan Li1, Yuyao Zhong1, Xiaobin Hu1, Lingyuan Lan1, Chunbo Liu2
Affiliations
  • 1North China Electric Power University, Baoding 071000, China
  • 2Jilin Electric Power Research Institute Co., Ltd., Changchun 130000, China
Published: 2026-07-20 doi: 10.16790/j.cnki.1009-9239.im.2026.07.015
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Insulation interface defects are a major cause of cable terminal failure in extreme cold environments, and the stress state at the epoxy resin/silicone rubber interface directly determines the mechanical integrity and the stability of thermal and electrical properties of the cable terminal interface. In this study, a simplified model of the epoxy resin/silicone rubber interface in cable terminals was first designed based on the actual assembly process. The interface stress of this simplified model under extreme cold conditions was calculated using finite element analysis. Then, a quantitative relationship model between the interface stress and the reflection coefficient of epoxy/silicone rubber composite samples was established using an ultrasonic pulse detection system. Finally, a simplified terminal model was fabricated, and ultrasonic pulse detection experiments were carried out under extreme cold environments ranging from 20℃ to -40℃. The interface stresses at different temperatures were inverted using the quantitative model and compared with the simulation results. The results show that the ultrasonic velocity in epoxy resin increases linearly with the decrease of temperature, and the increase rate is 3.446 7 m/(s·℃). During the process of cooling from 20℃ to -40℃, the interface stress of epoxy/silicone rubber decreases significantly due to the loss of interference caused by the temperature drop.The error between the simulation and experimental results remains around 5%, confirming the reliability of the proposed interface stress back-calculation method under extreme cold environments.

ultrasonic pulse method  /  interface stress  /  extreme cold environment  /  high-voltage cable terminal  /  non-destructive testing
Yan Li, Yan Li, Yuyao Zhong, Xiaobin Hu, Lingyuan Lan, Chunbo Liu. Ultrasonic detection of epoxy/silicone rubber interface stress under extreme cold conditions[J]. Insulating Materials, 2026 , 59 (7) : 131 -140 . DOI: 10.16790/j.cnki.1009-9239.im.2026.07.015
Year 2026 volume 59 Issue 7
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doi: 10.16790/j.cnki.1009-9239.im.2026.07.015
  • Receive Date:2025-07-04
  • Online Date:2026-09-10
  • Published:2026-07-20
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  • Received:2025-07-04
  • Revised:2025-08-04
Affiliations
    1North China Electric Power University, Baoding 071000, China
    2Jilin Electric Power Research Institute Co., Ltd., Changchun 130000, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2026.07.015
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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