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To address the bottleneck that thermal conductivity and dielectric properties are difficult to be synergistically enhanced for high-frequency and high-speed electronic packaging materials, silica (SiO2) was modified via surface grafting with methylvinyldimethoxysilane. The modified SiO2 (m-SiO2) particles were incorporated into thermosetting polyphenylene ether (MPPO) through solution blending, and m-SiO2/MPPO composites with low dielectric performance and high thermal conductivity were successfully prepared. The results demonstrate that the thermal conduction capability and thermal stability of the composites are remarkably improved, while its favorable dielectric properties are well maintained. At an m-SiO2 mass fraction of 70%, the thermal conductivity of the composite reaches 1.18 W/(m·K), which is 4.92 times higher than that of neat MPPO. Moreover, the dielectric constant is 3.11 at 10 GHz, and the dielectric loss factor is 0.004 4. Thermogravimetric analysis reveals that the thermal decomposition temperatures (at 5% and 10% weight loss) of the composite under nitrogen atmosphere are increased by 224.1℃ and 181.4℃, respectively compared with neat MPPO. It is verified that m-SiO2 can effectively inhibit the thermal degradation of polymer segments through bonding reaction with the resin matrix.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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