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Preparation and properties of solution-processable fluorene-containing polyimide films with low dielectric features
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Ruixuan WANG1, Jijia LANG1, Xiaohan WANG2, Duanyi LI1, Xi REN1, Zhenzhong WANG1, Jingang LIU1, 3, *
Insulating Materials | 2026, 59(6) : 103 - 112
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Insulating Materials | 2026, 59(6): 103-112
Preparation and properties of solution-processable fluorene-containing polyimide films with low dielectric features
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Ruixuan WANG1, Jijia LANG1, Xiaohan WANG2, Duanyi LI1, Xi REN1, Zhenzhong WANG1, Jingang LIU1, 3, *
Affiliations
  • 1School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China
  • 2College of Material Engineering, North China Institute of Aerospace Engineering, Langfang 065000, China
  • 3Disan New Materials Research & Development (Sanhe) Co., Ltd., Langfang 065200, China
Published: 2026-06-20 doi: 10.16790/j.cnki.1009-9239.im.2026.06.010
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Four fluorene-containing polyimide (PI) resins without per- and polyfluoroalkyl substances (PFAS), including PI-Ia (BPAF-BAOFL), PI-IIa (BPFDA-BAOFL), PI-Ib (BPAF-FDAADA), and PI-IIb (BPFDA-FDAADA) were prepared from two fluo-rene-containing dianhydrides 9,9-bis[(3,4-dicarboxy)benzene]fluorene dianhydride (BPAF, I) and 9,9-bis[4-(3,4-dicarboxyphenoxy)phenyl]fluorene dianhydride (BPFDA,II) and the fluorene-containing diamines 9,9-bis[(4-aminophenoxy)phenyl]fluorene (BAOFL,a) and 9,9-bis[4-(4-aminobenzamide)phenyl]fluorene (FDAADA,b), respectively via two-step chemical imidization procedure. The corresponding PI films were prepared by the solution processing procedure. The results show that the derived PI resins show good solubility in polar N-methyl-2-pyrrolidone (NMP), N,N-dimethylacetamide (DMAc) and cyclopentanone (CPA). The incorporation of fluorene substituents endows the PI films good thermal resistance with the glass transition temperatures (Tg) over 298℃. The BAOFL-based PI films (PI-Ia and PI-IIa) exhibit low dielectric features with the dielectric constants (Dk) and dielectric dissipation factors (Df) in the range of 2.87 to 3.20 and 0.006 6 to 0.012 3, respectively at 10 GHz. While the FDAADA-based PI films (PI-Ib and PI-IIb) shows a bit deteriorated dielectric feature due to the existence of polar amide units (-CONH-). However, the high-temperature dimensional stability of the FDAADA-based PI films is improved with the linear coefficient of thermal expansion (CTE) values as low as 38.9×10-6 K-1.

polyimide  /  fluorene  /  solubility  /  thermal properties  /  optical properties
Ruixuan WANG, Jijia LANG, Xiaohan WANG, Duanyi LI, Xi REN, Zhenzhong WANG, Jingang LIU. Preparation and properties of solution-processable fluorene-containing polyimide films with low dielectric features[J]. Insulating Materials, 2026 , 59 (6) : 103 -112 . DOI: 10.16790/j.cnki.1009-9239.im.2026.06.010
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Year 2026 volume 59 Issue 6
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doi: 10.16790/j.cnki.1009-9239.im.2026.06.010
  • Receive Date：2025-08-30
  • Online Date：2026-09-10
  • Published：2026-06-20
Article Data
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  • Received：2025-08-30
  • Revised：2025-09-28
Affiliations
    1School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China
    2College of Material Engineering, North China Institute of Aerospace Engineering, Langfang 065000, China
    3Disan New Materials Research & Development (Sanhe) Co., Ltd., Langfang 065200, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2026.06.010
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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