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Preparation of SiO2 filled hydrocarbon-resin-based copper-clad plates by solvent-free method and characterization of their performance
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Yuru YAN, Huilu LI, Chao WANG, Zixuan YU, Xiaolong XUE
Insulating Materials | 2025, 58(7) : 101 - 112
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Insulating Materials | 2025, 58(7): 101-112
Material Research
Preparation of SiO2 filled hydrocarbon-resin-based copper-clad plates by solvent-free method and characterization of their performance
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Yuru YAN, Huilu LI, Chao WANG, Zixuan YU, Xiaolong XUE
Affiliations
  • College of Materials Science and Engineering, Xi′an University of Science and Technology, Xi′an 710054, China
Published: 2025-07-20 doi: 10.16790/j.cnki.1009-9239.im.2025.07.012
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Using styrene-butadiene-styrene (SBS) as the resin matrix and SiO2 as the filler, SiO2/hydrocarbon high frequency hydrocarbon copper clad laminate with low dielectric loss were prepared by hot-pressing method using a double-roll open mill and a flat vulcanizing machine. The resin film forming method and the influence of different contents and morphologies of SiO2 under the open mill film on the dielectric performance, peel strength, thermal conductivity, tensile performance, and water absorption rate of high frequency hydrocarbon copper clad laminate were explored. The results show that compared with the traditional solvent-based resin film method, the solvent-free film production using an open mill has obvious advantages in the molding of composite resins and material properties. With the increase of SiO2 content, the dielectric constant and dielectric loss of the high frequency hydrocarbon copper clad laminate increase, while the peel strength and water absorption rate decrease. Under the same particle size and filling content of SiO2, the dielectric constant, dielectric loss factor, and water absorption rate of spherical SiO2/hydrocarbon high frequency hydrocarbon copper clad laminate are lower than those of angular SiO2/hydrocarbon high frequency hydrocarbon copper clad laminate. When the mass fraction of spherical SiO2 is 75%, the comprehensive performance of the carbon-hydrogen high-frequency board is relatively superior, with a dielectric constant lower than 3.3, a dielectric loss factor of 0.002 2, and a water absorption rate lower than 0.040%.

high frequency hydrocarbon copper clad laminate  /  styrene-butadiene-styrene (SBS)  /  solvent-free film making  /  low dielectric loss
Yuru YAN, Huilu LI, Chao WANG, Zixuan YU, Xiaolong XUE. Preparation of SiO2 filled hydrocarbon-resin-based copper-clad plates by solvent-free method and characterization of their performance[J]. Insulating Materials, 2025 , 58 (7) : 101 -112 . DOI: 10.16790/j.cnki.1009-9239.im.2025.07.012
Year 2025 volume 58 Issue 7
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doi: 10.16790/j.cnki.1009-9239.im.2025.07.012
  • Receive Date:2024-09-02
  • Online Date:2025-10-29
  • Published:2025-07-20
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  • Received:2024-09-02
  • Revised:2024-10-18
Affiliations
    College of Materials Science and Engineering, Xi′an University of Science and Technology, Xi′an 710054, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2025.07.012
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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