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Meta-aramid insulation paper is widely used in transformers and high-voltage bushings due to its excellent dielectric and mechanical properties, but its low thermal conductivity limits its application in high thermal load environments. To enhance the thermal conductivity of nano-filler/aramid insulation paper, this study employed simulation-guided experimental design to calculate the thermal conductivity of aramid simulation models. Three nano-fillers with excellent thermal conductivity properties, namely nano SiO2 (KH570), nano TiO2, and nano C3N4, were screened out. The mechanical and insulation performance of laboratory composite aramid paper hand sheets were compared, and the optimal filling amount was determined. Further, the influence of nano-fillers on the thermal conductivity of composite aramid paper was explored, and their inherent thermal conduction mechanism was analyzed. The results show that the optimal addition amounts of three nano-fillers are: nano SiO2 (KH570) at 10%, nano TiO2 at 4%, nano C3N4 at 4%. Through thermal conductivity testing, nano C3N4 is determined to be the optimal nano-filler, and the composite aramid paper with 4% of nano C3N4 showing an increase in elastic modulus by 135%, Young's modulus by 198%, electric strength by 60.24%, volume resistivity by 3 713%, and thermal conductivity by 304.31% compared with pure aramid paper.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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