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Preparation of self-leveling polyaddition silicone encapsulant with outstanding thermal conductivity
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Yang WU, Yu ZHANG, Shuangshuang SUN, Chuanzeng WANG, Hongtao LIN, Shuhai CHEN
Insulating Materials | 2025, 58(6) : 88 - 93
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Insulating Materials | 2025, 58(6): 88-93
Material Research
Preparation of self-leveling polyaddition silicone encapsulant with outstanding thermal conductivity
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Yang WU, Yu ZHANG, Shuangshuang SUN, Chuanzeng WANG, Hongtao LIN, Shuhai CHEN
Affiliations
  • School of Chemistry and Chemical Engineering, Shandong University of Technology, Zibo 255000, China
Published: 2025-06-20 doi: 10.16790/j.cnki.1009-9239.im.2025.06.011
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A kind of silicone encapsulant with excellent thermal conductivity, self-leveling properties, mechanical properties, and flame retardancy was prepared by employing end vinyl silicone oil with different viscosity as matrix, containing hydrogen silicone oil as cross-linking agent, and spherical alumina as thermal conductive and reinforcement filler. The effects of ratio of end vinyl silicone oils with different viscosity, molar ratio of active hydrogen and vinyl, filler ratio and filling amount on the performance of silicone encapsulant were investigated. The results show that the silicone encapsulant has the best performance when the PDMS-1 and PDMS-2 vinyl end silicone oil are mixed at a mass ratio of 1∶1 as the matrix, the molar ratio of active hydrogen and vinyl is 1.2, and the ratio of spherical alumina with different particle sizes m(5 μm)∶m(15 μm)∶m(50 μm)=2∶5∶3. When the total filling amount of different sizes of spherical alumina reaches 500 parts, the silicone encapsulant has up to 1.50 W/(m·K) of thermal conductivity, up to 1.70 MPa of tensile strength, FV-0 of vertical combustion grade, and excellent operation and processing performance as well as dispersing stability, and its comprehensive performance is excellent.

polyaddition silicone encapsulant  /  thermal conductivity  /  spherical alumina  /  flame retardance  /  self-leveling
Yang WU, Yu ZHANG, Shuangshuang SUN, Chuanzeng WANG, Hongtao LIN, Shuhai CHEN. Preparation of self-leveling polyaddition silicone encapsulant with outstanding thermal conductivity[J]. Insulating Materials, 2025 , 58 (6) : 88 -93 . DOI: 10.16790/j.cnki.1009-9239.im.2025.06.011
Year 2025 volume 58 Issue 6
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doi: 10.16790/j.cnki.1009-9239.im.2025.06.011
  • Receive Date:2024-07-06
  • Online Date:2025-12-04
  • Published:2025-06-20
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  • Received:2024-07-06
  • Revised:2024-09-14
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    School of Chemistry and Chemical Engineering, Shandong University of Technology, Zibo 255000, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2025.06.011
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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