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Modification and research of DOPO-based oligomer flame retardant for bisphenol A epoxy resin
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Xinyu LI1, 2, You ZHOU3, Anbin TANG1, 3
Insulating Materials | 2025, 58(6) : 61 - 66
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Insulating Materials | 2025, 58(6): 61-66
• Material Research •
Modification and research of DOPO-based oligomer flame retardant for bisphenol A epoxy resin
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Xinyu LI1, 2, You ZHOU3, Anbin TANG1, 3
Affiliations
  • 1. Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences, Chengdu 610213, China
  • 2. University of Chinese Academy of Sciences, Beijing 100190, China
  • 3. Sichuan EM Technology Co., Ltd., Mianyang 621000, China
Published: 2025-06-20 doi: 10.16790/j.cnki.1009-9239.im.2025.06.008
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Bisphenol A epoxy resin is widely used in the field of copper clad laminates. However, its flame retardancy and dielectric properties cannot meet the high-speed development of copper clad laminates. To simultaneously improve the flame retardancy and dielectric properties of epoxy resin, a reactive oligomeric flame retardant (PDDV) based on 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-HQ), 1,4-dichlorobenzene (DCX), and 4-vinylbenzyl chloride (VBC) was synthesized, and its chemical structure was determined by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR) characterization. EP/PDDV composites were prepared by physical blending, and their thermal, flame retardancy, and dielectric properties were tested. The results show that when the mass fraction of PDDV is 30%, the char yield of EP/PDDV composites increases to 38.74%, the glass transition temperature (Tg) rises to 138.9℃, the limiting oxygen index (LOI) increases to 55%, UL-94 reaches V-0 grade, the dielectric constant (Dk) is 2.69, and the dielectric loss factor (Df) is 0.007 91. The comprehensive performance of the composites is the best.

epoxy resin  /  oligomeric flame retardant  /  low dielectric loss  /  thermal performance  /  copper clad laminates
Xinyu LI, You ZHOU, Anbin TANG. Modification and research of DOPO-based oligomer flame retardant for bisphenol A epoxy resin[J]. Insulating Materials, 2025 , 58 (6) : 61 -66 . DOI: 10.16790/j.cnki.1009-9239.im.2025.06.008
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2025.06.008
  • Receive Date：2024-07-12
  • Online Date：2025-12-04
  • Published：2025-06-20
Article Data
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History
  • Received：2024-07-12
  • Revised：2024-09-05
Affiliations
    1. Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences, Chengdu 610213, China
    2. University of Chinese Academy of Sciences, Beijing 100190, China
    3. Sichuan EM Technology Co., Ltd., Mianyang 621000, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2025.06.008
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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