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Epoxy resin/micron-alumina composites are widely employed as supporting and insulating components in electrical power equipment, and their glass transition temperature and thermal expansion coefficient critically influence the long-term performance of electrical power equipment. Epoxy resin composite dielectrics containing 0%, 20%, 40%, and 60% mass fractions of micron-alumina fillers were prepared in this paper. Their thermal expansion coefficients and glass transition temperatures were calculated through numerical fitting of dielectric constant measurements at high-temperature and high-frequency. The results demonstrate that with the increase of the mass fraction of micron-alumina fillers, the thermal expansion coefficient of composite dielectrics reduces significantly, and the glass transition temperature also showing a decreasing trend. Comparative analysis between calculated values and existing experimental data reveals that the calculated value is consistent with the experimental value, confirming the scientific validity and effectiveness of dielectric spectroscopy as a methodology for evaluating the thermal properties of epoxy composite dielectrics. This approach can serves as an effective supplementary technique to conventional experimental methods for investigating the thermal characteristic of polymer.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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