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Synthesis of PTFE/FPI fluoropolyimide composite films and their dielectric properties under high frequency working conditions
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Weikai SUN1, Yaqin FU2, Haoxin CHANG1, Jingqi DAI1, 3, Wenguang FU4, Jianyi WANG5, Ming DONG1
Insulating Materials | 2025, 58(6) : 35 - 42
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Insulating Materials | 2025, 58(6): 35-42
• Special Issue on High Performance Polyimide Materials •
Synthesis of PTFE/FPI fluoropolyimide composite films and their dielectric properties under high frequency working conditions
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Weikai SUN1, Yaqin FU2, Haoxin CHANG1, Jingqi DAI1, 3, Wenguang FU4, Jianyi WANG5, Ming DONG1
Affiliations
  • 1. School of Electrical Engineering, Xi′an Jiaotong University, Xi′an 710049, China
  • 2. School of Materials Science and Engineering, Zhejiang Sci-Tech University, Hangzhou 310018, China
  • 3. Inner Mongolia Power (Group) Co., Ltd., Hohhot 010020, China
  • 4. Inner Mongolia Power Research Institute Branch, Inner Mongolia Power (Group) Co., Ltd., Hohhot 010020, China
  • 5. China Electric Power Research Institute, Beijing 100192, China
Published: 2025-06-20 doi: 10.16790/j.cnki.1009-9239.im.2025.06.005
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To develop polyimide (PI)-based composite films with low dielectric constant (Dk), low dielectric loss (Df), and high temperature resistance at high frequency, a water-soluble polyamic salt (PAAS) was prepared by adding organic base into the polyamic acid, which is the precursor of fluoropolyimide (FPI), and composite films were prepared by compounding low dielectric polytetrafluoroethylene (PTFE) concentrated dispersion with the dried PAAS to form a water dispersion system. The effects of PTFE content on the dielectric, thermal, and mechanical properties of the composite films were studied. The experimental results show that with the increase of PTFE content, the dielectric constant of the composite films decreases continuously, but there will be some effects on the thermal stability and mechanical properties. The dielectric constant of 50%PTFE/FPI reaches the minimum value (Dk=1.5@8.5 GHz), and the dielectric loss of 10%PTFE/FPI in the frequency band of 9.25-10.25 GHz is less than 0.005. The glass transition temperature of the composite films is in the range of 289-297℃, and the thermal decomposition temperature at 5% is higher than 508℃. The thermal expansion coefficient of 40%PTFE/FPI is as low as 59.67×10-6 K-1. The tensile strength of 20%PTFE/FPI is 70 MPa, the tensile modulus is 1.59 GPa, and the elongation at break is 7.7%.

fluoropolyimide composite films  /  dielectric constant  /  high frequency working conditions  /  heat resistance  /  all-organic system
Weikai SUN, Yaqin FU, Haoxin CHANG, Jingqi DAI, Wenguang FU, Jianyi WANG, Ming DONG. Synthesis of PTFE/FPI fluoropolyimide composite films and their dielectric properties under high frequency working conditions[J]. Insulating Materials, 2025 , 58 (6) : 35 -42 . DOI: 10.16790/j.cnki.1009-9239.im.2025.06.005
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Year 2025 volume 58 Issue 6
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2025.06.005
  • Receive Date：2024-09-28
  • Online Date：2025-12-04
  • Published：2025-06-20
Article Data
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History
  • Received：2024-09-28
  • Revised：2024-11-25
Funding
Affiliations
    1. School of Electrical Engineering, Xi′an Jiaotong University, Xi′an 710049, China
    2. School of Materials Science and Engineering, Zhejiang Sci-Tech University, Hangzhou 310018, China
    3. Inner Mongolia Power (Group) Co., Ltd., Hohhot 010020, China
    4. Inner Mongolia Power Research Institute Branch, Inner Mongolia Power (Group) Co., Ltd., Hohhot 010020, China
    5. China Electric Power Research Institute, Beijing 100192, China
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