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Simulation optimization on thermal conductivity and dielectric properties of alumina/polypropylene composites
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Shikun LI, Wenpeng LI, Xiaoning SHI, Weijia ZHAO, Bo WANG, Chong ZHANG, Xin CHEN
Insulating Materials | 2025, 58(1) : 20 - 28
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Insulating Materials | 2025, 58(1): 20-28
Material Research
Simulation optimization on thermal conductivity and dielectric properties of alumina/polypropylene composites
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Shikun LI, Wenpeng LI, Xiaoning SHI, Weijia ZHAO, Bo WANG, Chong ZHANG, Xin CHEN
Affiliations
  • State Key Laboratory of Advanced Power Transmission Technology, China Electric Power Research Institute, Beijing 102209, China
Published: 2025-01-20 doi: 10.16790/j.cnki.1009-9239.im.2025.01.003
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To investigate the influence of the filler network constructed by alumina (Al2O3) on the thermal and dielectric properties of polypropylene (PP) composites, this study constructed a finite element model of randomly filled Al2O3 fillers, and systematically studied the effects of factors such as filler content, filler particle size, and size matching of binary fillers on the thermal conductivity and dielectric constant of Al2O3/PP composites. The results indicate that increasing the filler content can significantly bridge the Al2O3 filler, synergistically construct an interconnected thermal conductive network and electric displacement pathway, thereby significantly improving the thermal conductivity and dielectric constant of Al2O3/PP composites. For single Al2O3 filled PP composites, the thermal conductivity and dielectric constant of composites cannot be effectively enhanced by regulating the size of Al2O3 filler. After introducing the multiscale fillers, at the optimized binary filler ratio of 70∶30 (40 μm∶15 μm), the overall thermal conductivity and electrical displacement networks show the dominant skeleton of large-sized filler and the bridging branch of small-sized fillers features, which synergistically contributes to the Al2O3/PP composite reach the optimal thermal conductivity (0.55 W/(m·K)) and dielectric constant (5.6).

alumina  /  polypropylene  /  thermal conductivity  /  dielectric constant  /  multiscale optimization
Shikun LI, Wenpeng LI, Xiaoning SHI, Weijia ZHAO, Bo WANG, Chong ZHANG, Xin CHEN. Simulation optimization on thermal conductivity and dielectric properties of alumina/polypropylene composites[J]. Insulating Materials, 2025 , 58 (1) : 20 -28 . DOI: 10.16790/j.cnki.1009-9239.im.2025.01.003
Year 2025 volume 58 Issue 1
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2025.01.003
  • Receive Date:2024-03-10
  • Online Date:2025-11-05
  • Published:2025-01-20
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  • Received:2024-03-10
  • Revised:2024-05-08
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    State Key Laboratory of Advanced Power Transmission Technology, China Electric Power Research Institute, Beijing 102209, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2025.01.003
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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