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A glass fiber winding reinforced epoxy resin composite with high thermal conductivity was prepared by filling the bisphenol A type epoxy resin system with a mixture of alumina and silica powder fillers. The effects of filler content on the mechanical properties, electrical properties, and thermal conductivity of composite were studied. The results show that the addition of mixed fillers is beneficial for improving the thermal stability and thermal conductivity of the composite. When the mass fraction of the fillers is 62% (of which the mass fraction of silicon powder is 48% and the mass fraction of alumina is 14%), the tensile strength (0° and 90° directions), bending strength, and NOL ring tensile strength of the composite are 160.25, 24.50, 245.40, and 134.30 MPa, respectively. The dielectric constant is 1.889, the dielectric loss factor is 0.673×10-2, the volume resistivity is 3.36×1016 Ω·cm, and the thermal conductivity is 1.257 W/(m·K), which is 155% higher than the thermal conductivity before addition.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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