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Photosensitive polyimide (PSPI) is a kind of high-performance polyimide with special structures, which is widely used in semiconductor packaging, integrated circuits, optical display, and other fields due to its excellent heat resistance, mechanical properties, insulating properties, and lithographic processability. In this paper, the PSPI patents applied in China were taken as object, the overall situation of these patents, including changes in the number of patent applications, applicants, and their source countries was analyzed systematically. Especially, the patent applicants inside and outside China and the patent subject distribution since 2011 were discussed. The difference of patent technology and protection priorities of enterprise applicants inside and outside China was compared in detail. The patent technology characteristics and development trends of PSPI were explored.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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