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Preparation and properties of high-temperature resistant and colorless transparent polyimide films based on side chain hydrogen bonding interaction
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Yuxiao YANG, Xiuting LI, Qingsong XU, Jie DONG, Xin ZHAO, Cuiqing TENG, Qinghua ZHANG
Insulating Materials | 2024, 57(10) : 16 - 25
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Insulating Materials | 2024, 57(10): 16-25
• Special Issue on High Performance Polyimide Materials •
Preparation and properties of high-temperature resistant and colorless transparent polyimide films based on side chain hydrogen bonding interaction
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Yuxiao YANG, Xiuting LI, Qingsong XU, Jie DONG, Xin ZHAO, Cuiqing TENG, Qinghua ZHANG
Affiliations
  • Stata Key Laboratory for Modification of Chemical Fibers and Polymer Materials, Donghua University, Shanghai 201620, China
Published: 2024-10-20 doi: 10.16790/j.cnki.1009-9239.im.2024.10.003
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With the constant updating of flexible display devices, the researches on colorless transparent polyimide (CPI) films as substrate materials have attracted considerable attention. In order to solve the inherent contradictions among optical performance, high-temperature resistance, dimensional stability, and mechanical properties of CPI, we synthesized a series of semi-aromatic CIP films with side chains containing benzimidazole by copolymerization using cyclobutanetetracarboxylic dianhydride (CBDA) as the dianhydride monomer, 2,2′-bis(trifluoromethyl)-4-diaminobiphenyl (TFMB) and 2-(3,5-diaminophenyl)-benzimidazole (BBIA) as diamine monomers. The influence of hydrogen bonding, free volume, and main chain structure on the properties of films was systematically investigated by the Materials Studio software simulation and experimental results. The results show that the prepared CPI films have excellent optical transparency, thermal resistance, and mechanical properties. The average transmittance of CPI films in wave length of 380-780 nm is higher than 85%, the glass transition temperature (Tg) is above 400℃, the linear coefficient of thermal expansion (CTE) is 15×10-6-17×10-6 K-1, the maximum tensile strength is 165 MPa, and the modulus is in the range of 3.7-5.2 GPa.

colorless and transparent polyimide  /  flexible display  /  hydrogen bonding interaction  /  heat resistance  /  optical properties  /  dimensional stability  /  mechanical properties  /  software simulation
Yuxiao YANG, Xiuting LI, Qingsong XU, Jie DONG, Xin ZHAO, Cuiqing TENG, Qinghua ZHANG. Preparation and properties of high-temperature resistant and colorless transparent polyimide films based on side chain hydrogen bonding interaction[J]. Insulating Materials, 2024 , 57 (10) : 16 -25 . DOI: 10.16790/j.cnki.1009-9239.im.2024.10.003
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doi: 10.16790/j.cnki.1009-9239.im.2024.10.003
  • Receive Date：2024-03-12
  • Online Date：2025-12-24
  • Published：2024-10-20
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  • Received：2024-03-12
  • Revised：2024-04-12
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    Stata Key Laboratory for Modification of Chemical Fibers and Polymer Materials, Donghua University, Shanghai 201620, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2024.10.003
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表12种不同金属材料的力学参数
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小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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