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Preparation and properties of copolyimide films containing pyridine ring structures
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Pinru LI, Yunhua LU, Min LEI, Guoyong XIAO, Hongbin ZHAO, Zhizhi HU
Insulating Materials | 2024, 57(10) : 9 - 15
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Insulating Materials | 2024, 57(10): 9-15
Special Issue on High Performance Polyimide Materials
Preparation and properties of copolyimide films containing pyridine ring structures
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Pinru LI, Yunhua LU, Min LEI, Guoyong XIAO, Hongbin ZHAO, Zhizhi HU
Affiliations
  • School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China
Published: 2024-10-20 doi: 10.16790/j.cnki.1009-9239.im.2024.10.002
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Firstly, a Y-shape diamine monomer 4-(4′-tertbutyl)phenyl-2,6-di(4′-aminophenyl)pyridine (TPAPP) containing pyridine ring structure and tertbutyl group was synthesized. Then, it was polymerized with 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP) and 4,4′-(4,4′-isopropyldiphenyloxy)bis(phthalic anhydride) (BPADA), and a series of copolyimide (PI) films were prepared by thermal imidization. The structure and optical, mechanical, and thermal properties as well as solubility of the PI films were investigated by infrared spectroscopy, X-ray diffraction, UV visible spectra, tensile tests, dynamic thermo-mechanical analysis, thermogravimetric analysis, and solubility tests. The results show that as the molar ratio of TPAPP increases, the optical transparency and glass transition temperature of the copolyimide films exhibit an increasing trend. When the molar ratio of diamine and dianhydride is 5:5, the copolyimide film shows the best mechanical properties, with the tensile strength of 144.9 MPa, the Young's modulus of 3.4 GPa, and the elongation at break of 9.3%. In addition, these copolyimides demonstrate good solubility in aprotic polar solvents.

pyridine ring  /  copolyimide  /  optical properties  /  mechanical properties  /  thermal properties
Pinru LI, Yunhua LU, Min LEI, Guoyong XIAO, Hongbin ZHAO, Zhizhi HU. Preparation and properties of copolyimide films containing pyridine ring structures[J]. Insulating Materials, 2024 , 57 (10) : 9 -15 . DOI: 10.16790/j.cnki.1009-9239.im.2024.10.002
Year 2024 volume 57 Issue 10
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doi: 10.16790/j.cnki.1009-9239.im.2024.10.002
  • Receive Date:2024-03-06
  • Online Date:2025-12-24
  • Published:2024-10-20
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  • Received:2024-03-06
  • Revised:2024-05-09
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    School of Chemical Engineering, University of Science and Technology Liaoning, Anshan 114051, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2024.10.002
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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