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The "thermal expansion and contraction" behavior of the internal atoms in epoxy resin and the intrinsic issue of low thermal conductivity seriously restrict the application of epoxy resin in dry-type DC sleeve insulation. To address this, we introduced boron nitride whiskers with low thermal expansion coefficient into epoxy resin to prepare a new boron nitride whisker/epoxy (BNw/EP) composite dielectric, and its microstructure, thermal expansion coefficient, thermal conductivity, electrical properties, thermal stability, and mechanical properties were tested and analyzed. The results show that within the temperature range of 20-100℃, the thermal expansion coefficient of the composite dielectric with 10% mass fraction of boron nitride whisker is reduced by 15% compared to pure epoxy resin, while the thermal conductivity increases to 0.28 W/(m·K), which is 33.33% higher than that of pure epoxy resin. In addition, its dielectric constant is below 5.28 and the dielectric loss is below 0.02 in the frequency range of 102-106 Hz, the volume resistivity is 1014 Ω·cm, and the tensile strength is maintained at about 49.5 MPa. This study proves that on the basis of ensuring the insulation, dielectric and mechanical properties of the composite dielectric be not damaged, filling the epoxy resin matrix with boron nitride whiskers can effectively reduce the thermal expansion coefficient of the material and improve the thermal conductivity.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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