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Preparation and bonding property of thermoplastic polyimide
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Wenqiu CHEN1, 2, 3, Wei CHEN1, 3, Juan HE2, Xiang NIU2, Zhenlin LI1, 2, 3, Heping FAN1, 2, 3
Insulating Materials | 2024, 57(7) : 22 - 27
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Insulating Materials | 2024, 57(7): 22-27
Material Research
Preparation and bonding property of thermoplastic polyimide
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Wenqiu CHEN1, 2, 3, Wei CHEN1, 3, Juan HE2, Xiang NIU2, Zhenlin LI1, 2, 3, Heping FAN1, 2, 3
Affiliations
  • 1HAISO Technology Co., Ltd., Wuhan 430074, China
  • 2Hubei Institute of Chemistry, Jianghan University, Wuhan 430056, China
  • 3HAISO Electronic Materials (Wuhan) Co., Ltd., Wuhan 430074,China
Published: 2024-07-20 doi: 10.16790/j.cnki.1009-9239.im.2024.07.003
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In order to improve the adhesion of thermoplastic polyimide (TPI) between thermosetting polyimide (PI) film and copper foil in two-layer flexible copper clad plate (2L-FCCL), a series of TPI samples were prepared by one-step reaction using flexible aromatic dianhydride monomers and aromatic or alicyclic diisocyanate monomers. Then, the selected TPI solution was directly coated on the pretreated commercial thermosetting PI film to obtain the composite film, and the corresponding 2L-FCCL was obtained by hot pressing at high temperature. By observing the state of the TPI reaction solution and conducting DSC testing, TPI-8 is selected, which is soluble in organic solvent and has a Tg of 226.5℃. Then, TGA, TMA, and tensile tests show that the 2% thermal decomposition temperature (T2%) of TPI-8 is 464℃, the thermal expansion coefficient (CTE) of 50-200℃ is 64.25×10-6-1, the tensile strength is 64.52 MPa, the elastic modulus is 1.75 GPa, and the elongation at break is 62%, and its chemical structure is confirmed by FTIR. Finally, the effect of alkaline pretreatment time of two kinds of thermosetting PI films on the bonding properties of resulting FCCLs was studied. It is found that the 90° peel strength (90°PS) of FCCLs are over 0.7 N/mm and the maximum value is 0.94 N/mm after SPI films treated with alkaline water at 60℃ for 1 min and 3 min. However, the 90°PS of FCCLs obtained by UPI films treated with the same hot alkaline water for 1-7 min are all less than 0.6 N/mm. Therefore, this method can be used to quickly and simply prepare TPI by one step, which is soluble and has good thermal, mechanical properties and dimensional stability. Meanwhile, it has good bonding properties for copper foil and SPI that the surface was pretreated with alkali water, and meets the requirements of relevant FCCL standards.

polyimide  /  flexible copper clad  /  thermoplasticity  /  thermosetting  /  bonding property
Wenqiu CHEN, Wei CHEN, Juan HE, Xiang NIU, Zhenlin LI, Heping FAN. Preparation and bonding property of thermoplastic polyimide[J]. Insulating Materials, 2024 , 57 (7) : 22 -27 . DOI: 10.16790/j.cnki.1009-9239.im.2024.07.003
Year 2024 volume 57 Issue 7
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2024.07.003
  • Receive Date:2023-06-05
  • Online Date:2025-12-24
  • Published:2024-07-20
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  • Received:2023-06-05
  • Revised:2023-07-14
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Affiliations
    1HAISO Technology Co., Ltd., Wuhan 430074, China
    2Hubei Institute of Chemistry, Jianghan University, Wuhan 430056, China
    3HAISO Electronic Materials (Wuhan) Co., Ltd., Wuhan 430074,China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2024.07.003
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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