Epoxy resin (EP) has been widely applied in electrical insulating materials, but with a low thermal conductivity, it cannot meet the requirement of heat dissipation in modern electrical equipment with high-power density. In this paper, silver acetate (AgAc) and 2-ethyl-4-methylimidazole (2E4MI) complex was deposited on boron nitride (BN) surface to prepare imidazole-silver modified BN hybrid materials (Ag(2E4MI)2Ac@BN), then Ag(2E4MI)2Ac@BN was filled in EP to prepare Ag(2E4MI)2Ac@BN/EP composites,and its thermal conductivity was studied. The results show that when the volume fraction of filler is 20%, the thermal conductivity of Ag(2E4MI)2Ac@BN/EP composites is 1.72 W/(m·K), which is 79.2% higher than that of BN/EP composites (0.96 W/(m·K)). The results of Monte Carlo simulation show that in the EP matrix, the thermal contact resistance (Rc) of Ag(2E4MI)2Ac@BN is 2.7×106 K/W, which is lower than the that of BN (Rc=5.5×106 K/W). In comparison with BN/EP composites, Ag(2E4MI)2Ac@BN/EP composites exhibit higher tensile strength and dielectric loss tangent (tanδ), lower dielectric strength and volume resistivity, while maintain good electrical insulating properties.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |