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Simulation study on hot spot temperature rise of dry reactor with high thermal conductive epoxy composite as encapsulating material
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Zhanyu QU1, Yuyao ZHONG1, Yanze SONG1, 2, Zihao XIE1, Yuqi MENG1, Qing XIE1, 2
Insulating Materials | 2024, 57(4) : 109 - 114
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Insulating Materials | 2024, 57(4): 109-114
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Simulation study on hot spot temperature rise of dry reactor with high thermal conductive epoxy composite as encapsulating material
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Zhanyu QU1, Yuyao ZHONG1, Yanze SONG1, 2, Zihao XIE1, Yuqi MENG1, Qing XIE1, 2
Affiliations
  • 1Department of Electrical Engineering, North China Electric Power University, Baoding 071003, China
  • 2State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing 102206, China
Published: 2024-04-20 doi: 10.16790/j.cnki.1009-9239.im.2024.04.015
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The stable operation of dry-type reactors affects the transmission reliability of new power system. The encapsulating material of dry-type reactor is made of glass fiber filament impregnated epoxy resin cured at high temperature. In this paper, a multiphysics coupled finite element method was used to consider the influence of thermal conductivity of the encapsulating material for dry-type reactor on its hot spot temperature rise, and a COMSOL microscopic simulation model of epoxy composites and an electro-magnetic and flow-thermal coupling calculation model of dry-type reactor under the constraints of external circuits were established. The temperature field and flow field distribution were calculated by using the loss under electromagnetic field as the heat source, and the influence of conventional/high thermal conductive epoxy composites on the hot spot temperature rise of the dry-type reactor at 25℃ of ambient temperature was studied. The results show that the high thermal conductive epoxy resin has a significant improving effect on the thermal conductivity of composites. The maximum hot spot temperature rise in the temperature field area of the encapsulating material body and the surrounding air is 103.75℃, which appears at the upper end of the fourth layer of encapsulating material. The epoxy resin composite with different thermal conductivity has obvious difference on decreasing the hot spot temperature of dry-type reactor, and the hot spot temperature of the dry-type reactor with high thermal conductive epoxy resin composite is reduced by 7.55℃.

dry hollow reactor  /  thermal conductivity  /  hot spot temperature rise  /  multiphysical field coupling
Zhanyu QU, Yuyao ZHONG, Yanze SONG, Zihao XIE, Yuqi MENG, Qing XIE. Simulation study on hot spot temperature rise of dry reactor with high thermal conductive epoxy composite as encapsulating material[J]. Insulating Materials, 2024 , 57 (4) : 109 -114 . DOI: 10.16790/j.cnki.1009-9239.im.2024.04.015
Year 2024 volume 57 Issue 4
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2024.04.015
  • Receive Date:2023-04-15
  • Online Date:2025-12-22
  • Published:2024-04-20
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  • Received:2023-04-15
  • Revised:2023-07-07
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    1Department of Electrical Engineering, North China Electric Power University, Baoding 071003, China
    2State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing 102206, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2024.04.015
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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