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Epoxy molding compounds (EMC) play important roles in packaging of chips for electrically controlling systems of electric vehicles (EV). The increasing working temperature of EV controlling system puts forward higher and higher requirements for the thermal stability of traditional EMC materials. In this paper, the progress on the high temperature resistant molding compounds at home and abroad in recent years was reviewed, and the development status of high temperature resistant resins and the progress of high temperature resistant resins modified traditional epoxy resin based EMC materials were described. Especially, the development status of high temperature resistant EMC materials modified by bismaleimide (BMI), cyanate ester (CE), and polybenzoxazine (PBZ) and phthalonitrile (PN) based molding compounds were reviewed. Finally, the future development trend of high temperature resistant molding compounds for packaging of electronic control chip in EV was prospected.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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