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Preparation of fluororesin-based film with low dielectric loss and high mechanical strength and its copper clad laminate
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Yang WANG, Huangping ZHANG, Sha XU
Insulating Materials | 2023, 56(8) : 22 - 26
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Insulating Materials | 2023, 56(8): 22-26
Material Research
Preparation of fluororesin-based film with low dielectric loss and high mechanical strength and its copper clad laminate
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Yang WANG, Huangping ZHANG, Sha XU
Affiliations
  • Allstar Tech (Zhongshan) Co., Ltd., Zhongshan 528437, China
Published: 2023-08-20 doi: 10.16790/j.cnki.1009-9239.im.2023.08.003
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The meltable polytetrafluoroethylene (PFA) was used as the matrix resin. Firstly, the PFA resin was modified by blending and filling with polymer and inorganic fillers to prepare suspension. Then, the suspension was coated and sintered in turn to prepare fluororesin-based film. Finally, the fluororesin-based film and copper foil were pressed together to prepare flexible copper clad laminate (FCCL). The results show that the prepared FCCL has 0.001 5 (10 GHz) of dielectric loss, 38 MPa of tensile strength, 0.05% of water absorption rate, greater than 1.0 kgf/cm of peel strength, and there is no delamination, oxidation, foaming in the soldering resistance test (300℃, 10 s, 3 times), which indicates that the FCCL has better overall performance.

fluorine resin  /  tensile strength  /  low dielectric loss  /  blending modification
Yang WANG, Huangping ZHANG, Sha XU. Preparation of fluororesin-based film with low dielectric loss and high mechanical strength and its copper clad laminate[J]. Insulating Materials, 2023 , 56 (8) : 22 -26 . DOI: 10.16790/j.cnki.1009-9239.im.2023.08.003
Year 2023 volume 56 Issue 8
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doi: 10.16790/j.cnki.1009-9239.im.2023.08.003
  • Receive Date:2022-08-26
  • Online Date:2025-11-24
  • Published:2023-08-20
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  • Received:2022-08-26
  • Revised:2022-11-21
Affiliations
    Allstar Tech (Zhongshan) Co., Ltd., Zhongshan 528437, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2023.08.003
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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