收藏切换
Preparation and characterization of single component high thermal conductive structural adhesive
收藏切换
PDF
Jialiang CHEN, Gang WANG, Ting XIA, Jianfeng SU, Huilu LI
Insulating Materials | 2023, 56(7) : 25 - 31
Less
收藏切换
Insulating Materials | 2023, 56(7): 25-31
Material Research
Preparation and characterization of single component high thermal conductive structural adhesive
Full
Jialiang CHEN, Gang WANG, Ting XIA, Jianfeng SU, Huilu LI
Affiliations
  • College of Material Science and Engineering, Xi′an University of Science and Technology, Xi′an 710054, China
Published: 2023-07-20 doi: 10.16790/j.cnki.1009-9239.im.2023.07.005
Outline
收藏切换

A base gel was prepared with bisphenol A epoxy resin E124 as the main resin, polymercaptan as the curing agent, and imidazole as the accelerator. A single component high thermal conductive structural adhesive was prepared by adding different proportions and sizes of spherical alumina and irregular alumina into the base gel. The effects of different filling content and different particle sizes of alumina on the thermal conductivity, bonding strength, viscosity, and thixotropy of the single component high thermal conductive structural adhesive were studied. The results show that when the mass ratio of base gel to the three different particle sizes of alumina is m(base gel)∶m(40 μm Al2O3)∶m(2 μm Al2O3)∶m(0.5 μm Al2O3) =15∶59.5∶25.5∶6, m(base gel)∶m(40 μm Al2O3)∶m(5 μm Al2O3)∶m(0.5 μm Al2O3) =15∶59.5∶25.5∶8, m(base gel)∶m(40 μm Al2O3)∶m(10 μm Al2O3)∶m(0.5 μm Al2O3)=15∶68∶17∶8, three kinds of high thermal conductive structural adhesives cured at 90℃ for 15 min can be obtained, their thermal conductivity is 2.73, 3.05, 2.85 W/(m·K), their bonding strength is 5.49, 5.55 and 5.31 MPa, and their viscosity is 145 000, 127 467 and 118467 mPa·s, respectively. The volume resistivity of the three kinds of high thermal conductive structural adhesives is above 1014 Ω·m, and the adhesive survival rate after high temperature and humidity, cold and thermal shock is more than 70% and 90%, respectively. The performance of the high thermal conductive structural adhesive meets the basic performance requirements of screen printing and heat dissipation materials for chip packaging.

epoxy resin  /  viscosity  /  thermal conductivity  /  bonding strength  /  alumina  /  filler
Jialiang CHEN, Gang WANG, Ting XIA, Jianfeng SU, Huilu LI. Preparation and characterization of single component high thermal conductive structural adhesive[J]. Insulating Materials, 2023 , 56 (7) : 25 -31 . DOI: 10.16790/j.cnki.1009-9239.im.2023.07.005
Year 2023 volume 56 Issue 7
PDF
204
95
Cite this Article
BibTeX
Article Info
doi: 10.16790/j.cnki.1009-9239.im.2023.07.005
  • Receive Date:2022-09-14
  • Online Date:2025-11-24
  • Published:2023-07-20
Article Data
Affiliations
History
  • Received:2022-09-14
  • Revised:2022-11-09
Funding
Affiliations
    College of Material Science and Engineering, Xi′an University of Science and Technology, Xi′an 710054, China
References
Share
https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2023.07.005
Share to
QR

Scan QR to access full text

Cite this article
BibTeX
Citations
表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
  • BibTeX
  • EndNote
  • RefWorks
  • TxT