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Progress of thermal conductive silicone composites for electronic packaging
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Lüe XIANG1, 2, Yeqin ZHANG1, 2, Yuqiang BAO1, 2, Zhe WANG1, 2, Yunran WANG1, 2, Yunzhong MAO1, 2, Yuanjian ZHOU1, 2
Insulating Materials | 2023, 56(7) : 9 - 15
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Insulating Materials | 2023, 56(7): 9-15
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Progress of thermal conductive silicone composites for electronic packaging
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Lüe XIANG1, 2, Yeqin ZHANG1, 2, Yuqiang BAO1, 2, Zhe WANG1, 2, Yunran WANG1, 2, Yunzhong MAO1, 2, Yuanjian ZHOU1, 2
Affiliations
  • 1China Bluestar Chengrand Co., Ltd., Chengdu 610041, China
  • 2National Silicone Engineering Technology Research Center, Chengdu 610041, China
Published: 2023-07-20 doi: 10.16790/j.cnki.1009-9239.im.2023.07.002
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The thermal conductivity mechanism and common thermal conductive fillers of thermal conductive silicone composites for electronic packaging were presented, the preparation strategies and research progress of filled-type high thermal conductive silicone composites were reviewed, and the future research direction of thermal conductive silicone composites for electronic packaging was prospected.

silicone  /  electronic packaging  /  composite  /  thermal conductivity  /  filled-type polymer
Lüe XIANG, Yeqin ZHANG, Yuqiang BAO, Zhe WANG, Yunran WANG, Yunzhong MAO, Yuanjian ZHOU. Progress of thermal conductive silicone composites for electronic packaging[J]. Insulating Materials, 2023 , 56 (7) : 9 -15 . DOI: 10.16790/j.cnki.1009-9239.im.2023.07.002
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2023.07.002
  • Receive Date：2022-10-11
  • Online Date：2025-11-24
  • Published：2023-07-20
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  • Received：2022-10-11
  • Revised：2022-11-18
Affiliations
    1China Bluestar Chengrand Co., Ltd., Chengdu 610041, China
    2National Silicone Engineering Technology Research Center, Chengdu 610041, China
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多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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