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Silicone gel and its applications in IGBT power module package
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Liang ZENG1, 2, Yong HE1, 2, Liang LIU1, 2, Xiaoping DAI1, 2, Junjie ZHANG3
Insulating Materials | 2023, 56(5) : 26 - 31
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Insulating Materials | 2023, 56(5): 26-31
• Material Research •
Silicone gel and its applications in IGBT power module package
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Liang ZENG1, 2, Yong HE1, 2, Liang LIU1, 2, Xiaoping DAI1, 2, Junjie ZHANG3
Affiliations
  • 1Coresing Semiconductor Technology Co., Ltd., Zhuzhou 412001, China
  • 2Hunan Power Semiconductor Manufacturing Innovation Center, Zhuzhou 412001, China
  • 3Guilin Electrical Equipment Scientific Research Institute Co., Ltd., Guilin 541004, China
Published: 2023-05-20 doi: 10.16790/j.cnki.1009-9239.im.2023.05.005
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In order to evaluate the application of silicone gels in the packaging of IGBT power modules, three domestic silicone gels were selected for comprehensive comparison, including the appearance, density, viscosity, mixing ratio, and gel time before curing and insulating properties, oil penetration, damping, adhesion force, and high temperature resistance at 200℃ after curing. The differences of the three silicone gels were analyzed, and IGBT power module was encapsulated with the three silicone gels, respectively, then the encapsulated modules were conducted the temperature cycle test. The results show that the initial viscosity and mixing ratio of silicone gels have an impact on the packaging process and equipment, and the penetration, insulating properties, oil penetration, damping, and adhesion after curing have a guiding role in the selection of silicone gel, but the high temperature resistance and temperature cycling resistance are the most important indicators to evaluate whether the sample can be applied to the packaging of IGBT power module.

silicone gel  /  packaging material  /  power module  /  IGBT module
Liang ZENG, Yong HE, Liang LIU, Xiaoping DAI, Junjie ZHANG. Silicone gel and its applications in IGBT power module package[J]. Insulating Materials, 2023 , 56 (5) : 26 -31 . DOI: 10.16790/j.cnki.1009-9239.im.2023.05.005
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2023.05.005
  • Receive Date：2022-05-10
  • Online Date：2025-11-21
  • Published：2023-05-20
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History
  • Received：2022-05-10
  • Revised：2022-06-13
Funding
Affiliations
    1Coresing Semiconductor Technology Co., Ltd., Zhuzhou 412001, China
    2Hunan Power Semiconductor Manufacturing Innovation Center, Zhuzhou 412001, China
    3Guilin Electrical Equipment Scientific Research Institute Co., Ltd., Guilin 541004, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2023.05.005
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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