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Preparation of thermally conductive BN/PI composite films by low-viscosity poly(amic acid)
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Mengyan GAO1, 2, Qi PANG1, 2, Lei ZHAI1, Chang’ou WANG1, 2, Yan JIA1, 2, Song MO1, Minhui HE1, Lin FAN1, 2
Insulating Materials | 2023, 56(2) : 46 - 53
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Insulating Materials | 2023, 56(2): 46-53
• Polyimide Film Special Issue •
Preparation of thermally conductive BN/PI composite films by low-viscosity poly(amic acid)
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Mengyan GAO1, 2, Qi PANG1, 2, Lei ZHAI1, Chang’ou WANG1, 2, Yan JIA1, 2, Song MO1, Minhui HE1, Lin FAN1, 2
Affiliations
  • 1Key Laboratory of Science and Technology on High-tech Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  • 2School of Chemical Sciences, University of Chinese Academy of Sciences, Beijing 100049, China
Published: 2023-02-20 doi: 10.16790/j.cnki.1009-9239.im.2023.02.007
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In order to solve the problem of agglomeration and poor dispersion of fillers in high-viscosity poly(amic acid) (PAA), we prepared PAA solution with low viscosity by anhydride hydrolysis method using PAA solution of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA) under a high solid content. On this basis, boron nitride/polyimide (BN/PI) composite films with the mass fraction of BN ranging from 0 to 40% were prepared by ultrasonic pulverization pretreatment and high-efficiency ball milling mixing process. The dispersion of fillers and the mechanical properties, heat resistance and thermal conductivity of composite films were systematically investigated. The results show that the low viscosity of PAA and the mixing process improve the dispersibility of fillers and have an important impact on the properties of BN/PI composite films. When the mass fraction of filler is 40%, the tensile strength of the composite film is about 140 MPa, the glass transition temperature is 385.2℃. The maximum thermal conductivity is up to 0.741 W/(m·K), which is 338% higher than that of pure polyimide film.

polyimide  /  boron nitride  /  dispersibility  /  composite film  /  thermal conductivity
Mengyan GAO, Qi PANG, Lei ZHAI, Chang’ou WANG, Yan JIA, Song MO, Minhui HE, Lin FAN. Preparation of thermally conductive BN/PI composite films by low-viscosity poly(amic acid)[J]. Insulating Materials, 2023 , 56 (2) : 46 -53 . DOI: 10.16790/j.cnki.1009-9239.im.2023.02.007
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2023.02.007
  • Receive Date：2022-05-17
  • Online Date：2025-11-21
  • Published：2023-02-20
Article Data
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History
  • Received：2022-05-17
  • Revised：2022-06-28
Funding
Affiliations
    1Key Laboratory of Science and Technology on High-tech Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
    2School of Chemical Sciences, University of Chinese Academy of Sciences, Beijing 100049, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2023.02.007
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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