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Molecular Simulation of Interfacial Bond Strength Between SiO2 Grafting PMMA Short Link and Silicone Rubber Substrate
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Chengjiang WANG, Hongping ZENG, Mingrui GUO, Yang ZHANG, Jing ZHANG, Mengya ZHU
Insulating Materials | 2022, 55(4) : 62 - 70
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Insulating Materials | 2022, 55(4): 62-70
• Insulation Technology •
Molecular Simulation of Interfacial Bond Strength Between SiO2 Grafting PMMA Short Link and Silicone Rubber Substrate
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Chengjiang WANG, Hongping ZENG, Mingrui GUO, Yang ZHANG, Jing ZHANG, Mengya ZHU
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  • College of Electrical Engineering & New Energy, China Three Gorges University, Yichang 443002, China
Published: 2022-04-20 doi: 10.16790/j.cnki.1009-9239.im.2022.04.009
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In order to improve the bonding strength of SiO2 and methyl vinyl silicone rubber (MVSR) matrix, we selected poly(methyl methacrylate) (PMMA) as the graft chain of SiO2. Molecular simulation was used to calculate the change of binding energy, molecular overlap length, and mean orientation shift. The change law of interface bonding strength between SiO2 and MVSR matrix under different graft densities and lengths of PMMA short chains and the effects of electric field and temperature on the interface bonding strength were studied, and compared with SiO2 ungrafted and KH570 grafted. The results show that as a graft chain, PMMA has a better improve effect on the interface bonding strength of SiO2 and MVSR than the common silicone coupling agent KH570. When the graft density is 13% or 16%, and the graft chain length is 5, PMMA shows the best grafting effect. Under negative electric field, the interfacial bonding strength increases with the increase of the field intensity, while it decreases with the increase of the field intensity under the positive electric field. With the increase of temperature, the bonding strength between SiO2 and MVSR interface decreases continuously.

PMMA  /  temperature  /  electric field  /  interfacial bonding strength  /  molecular simulation
Chengjiang WANG, Hongping ZENG, Mingrui GUO, Yang ZHANG, Jing ZHANG, Mengya ZHU. Molecular Simulation of Interfacial Bond Strength Between SiO2 Grafting PMMA Short Link and Silicone Rubber Substrate[J]. Insulating Materials, 2022 , 55 (4) : 62 -70 . DOI: 10.16790/j.cnki.1009-9239.im.2022.04.009
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doi: 10.16790/j.cnki.1009-9239.im.2022.04.009
  • Receive Date：2021-07-01
  • Online Date：2025-12-22
  • Published：2022-04-20
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  • Received：2021-07-01
  • Revised：2021-08-10
Affiliations
    College of Electrical Engineering & New Energy, China Three Gorges University, Yichang 443002, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2022.04.009
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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