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In order to evaluate the application of epoxy potting sealant in China on the packaging of insulated gate bipolar transistor (IGBT) power modules, we selected two domestic epoxy pouring sealant to compare their properties, including the viscosity, density, and gel time before curing, and the basic properties, thermal properties, and insulating properties after curing. The difference between the two epoxy potting sealants were analyzed, and IGBT power modules were encapsulated with them, respectively. Environmental tests such as high temperature storage, low temperature storage, and temperature cycle were conducted on the IGBT modules. The results show that the two epoxy potting adhesives have different toughening mechanism, mixing ratio, curing temperature, mechanical strength, and Tg value, which have some effect on the package. CTE value is the most important parameter that affects the application of epoxy potting adhesives in IGBT module package.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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