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Research on Development Status of High-frequency Copper-clad Laminate on Basis of Patent Analysis
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Kai SHEN1, Yingjie REN2, Fan ZHANG1, Quanjin SHEN2, Xiaoling HE2, Qiaoling WU1
Insulating Materials | 2021, 54(12) : 101 - 106
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Insulating Materials | 2021, 54(12): 101-106
• Test and Analysis •
Research on Development Status of High-frequency Copper-clad Laminate on Basis of Patent Analysis
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Kai SHEN1, Yingjie REN2, Fan ZHANG1, Quanjin SHEN2, Xiaoling HE2, Qiaoling WU1
Affiliations
  • 1Institute of Scientific and Technical Information of Zhejiang Province, Hangzhou 310006, China
  • 2Zhejiang WAZAM New Material Co., Ltd., Hangzhou 311121, China
Published: 2021-12-20 doi: 10.16790/j.cnki.1009-9239.im.2021.12.016
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High-frequency copper-clad laminate is the core foundation to the development of 5G related industries, it has high technical threshold and broad market prospects. In order to clarify the development trend of high-frequency copper-clad laminate field, we comprehensively excavated and deeply studied the patent big data of high-frequency copper-clad laminate and its key technologies, including resin, fiber cloth, filler, and copper foil. The results show that the field of high-frequency copper-clad laminate is still in a period of rapid development, and the technology evolution of resin, fiber cloth, filler, and copper foil are aimed at achieving stable dielectric constant and low dielectric loss. Companies from the USA and Japan occupy the dominant position, the application amount of patent form Hitachi, Sumitomo, Panasonic, Mitsubishi and other Japanese companies are in the front rank. The research on high frequency copper-clad laminate in China starts late but develops rapidly, with two major research and development highlands formed in Guangdong and Jiangsu, and advantageous enterprises emerged such as Shengyi Technology and WAZAM New Materials. However, on the whole, patent technologies of China lack core competitiveness and face strong patent barriers. Accordingly, the countermeasures and suggestions for the high-quality development of high-frequency copper-clad laminate industry in China are put forward.

high-frequency copper-clad laminate  /  patent analysis  /  technology evolution
Kai SHEN, Yingjie REN, Fan ZHANG, Quanjin SHEN, Xiaoling HE, Qiaoling WU. Research on Development Status of High-frequency Copper-clad Laminate on Basis of Patent Analysis[J]. Insulating Materials, 2021 , 54 (12) : 101 -106 . DOI: 10.16790/j.cnki.1009-9239.im.2021.12.016
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.12.016
  • Receive Date：2021-01-28
  • Online Date：2026-03-23
  • Published：2021-12-20
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History
  • Received：2021-01-28
  • Revised：2021-03-17
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Affiliations
    1Institute of Scientific and Technical Information of Zhejiang Province, Hangzhou 310006, China
    2Zhejiang WAZAM New Material Co., Ltd., Hangzhou 311121, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.12.016
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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