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Application of Thermally Conductive Insulating Materials in Power Electronics Packaging
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Hui TONG1, Likun ZANG2, Ju XU1, 3
Insulating Materials | 2021, 54(12) : 1 - 9
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Insulating Materials | 2021, 54(12): 1-9
• Review •
Application of Thermally Conductive Insulating Materials in Power Electronics Packaging
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Hui TONG1, Likun ZANG2, Ju XU1, 3
Affiliations
  • 1Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China
  • 2University of Science and Technology Beijing, Beijing 100083, China
  • 3University of Chinese Academy of Sciences, Beijing 100049, China
Published: 2021-12-20 doi: 10.16790/j.cnki.1009-9239.im.2021.12.001
Outline
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This review mainly discusses the insulating materials adapted in chip packaging process from the perspective of the application of current silicon-based and next-generation silicone carbide (SiC) and other wide-bandgap semiconductor in power electronics packing, and prospects its future research trends towards requirements of high thermal conductivity and high temperature resistance.

thermal conductive  /  insulating material  /  power electronic device  /  packaging
Hui TONG, Likun ZANG, Ju XU. Application of Thermally Conductive Insulating Materials in Power Electronics Packaging[J]. Insulating Materials, 2021 , 54 (12) : 1 -9 . DOI: 10.16790/j.cnki.1009-9239.im.2021.12.001
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Year 2021 volume 54 Issue 12
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.12.001
  • Receive Date：2020-09-08
  • Online Date：2026-03-23
  • Published：2021-12-20
Article Data
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History
  • Received：2020-09-08
  • Revised：2021-04-12
Funding
Affiliations
    1Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China
    2University of Science and Technology Beijing, Beijing 100083, China
    3University of Chinese Academy of Sciences, Beijing 100049, China
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红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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