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Preparation and Properties of AgNWs@SiO2/PI Composite Films
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Yuting WANG, Zijian WU, Zhengfang WANG, Xuefei WANG, Ning GUO, Xiaorui ZHANG, Yingyi MA, Hao CHEN, Ling WENG
Insulating Materials | 2021, 54(11) : 120 - 125
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Insulating Materials | 2021, 54(11): 120-125
• Polyimide Film Special Issue •
Preparation and Properties of AgNWs@SiO2/PI Composite Films
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Yuting WANG, Zijian WU, Zhengfang WANG, Xuefei WANG, Ning GUO, Xiaorui ZHANG, Yingyi MA, Hao CHEN, Ling WENG
Affiliations
  • Harbin University of Science and Technology, Harbin 150000, China
Published: 2021-11-22 doi: 10.16790/j.cnki.1009-9239.im.2021.11.017
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In order to improve the thermal conductivity of polyimide film and maintain its insulating properties, SiO2 was used to coat AgNWs to obtain AgNWs@SiO2 core-shell structure. At First, the AgNWs@SiO2 was dispersed in polyamide acid (PAA) discharge fiber by electrospinning technology, and the heat conduction path and the dispersity of AgNWs@SiO2 in PI matrix was planned and improved by electrospinning technology, respectively. Then the PAA glue containing AgNWs@SiO2 was used to impregnate PAA electrospun film, and an E-AgNWs@SiO2/PI composite film was obtained after thermal imidization. The effects of filler modification and content on the thermal conductivity and insulating properties of the composite films were studied. The results show that when the mass fraction of filler is 25%, the thermal conductivity of E-AgNWs/PI and E-AgNWs@SiO2/PI composite films is 2.92 W/(m·K) and 2.80 W/(m·K), which are 14.6 and 14 times higher than those of pure PI films, respectively. The dielectric constant of E-AgNWs@SiO2/PI composite film decreases to below 5, the dielectric loss factor maintains below 0.015, and the volume resistivity increases to 1.79×1013 Ω·m.

polyimide  /  silver nanowires  /  silica coating  /  electrospinning  /  thermal conductive and insulation
Yuting WANG, Zijian WU, Zhengfang WANG, Xuefei WANG, Ning GUO, Xiaorui ZHANG, Yingyi MA, Hao CHEN, Ling WENG. Preparation and Properties of AgNWs@SiO2/PI Composite Films[J]. Insulating Materials, 2021 , 54 (11) : 120 -125 . DOI: 10.16790/j.cnki.1009-9239.im.2021.11.017
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Year 2021 volume 54 Issue 11
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doi: 10.16790/j.cnki.1009-9239.im.2021.11.017
  • Receive Date：2021-04-30
  • Online Date：2026-03-23
  • Published：2021-11-22
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  • Received：2021-04-30
  • Revised：2021-06-13
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    Harbin University of Science and Technology, Harbin 150000, China
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
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Genus		 种数
Number of
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Percentage of total
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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