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Influence of Dianhydride Composition on Aggregated Structure and Thermomechanical Properties of PI Films
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Shihui LI1, Chuanguo MA1, 2, 3, Peibang DAI1, 2, 3, Shuanggui QING4
Insulating Materials | 2021, 54(11) : 108 - 113
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Insulating Materials | 2021, 54(11): 108-113
• Polyimide Film Special Issue •
Influence of Dianhydride Composition on Aggregated Structure and Thermomechanical Properties of PI Films
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Shihui LI1, Chuanguo MA1, 2, 3, Peibang DAI1, 2, 3, Shuanggui QING4
Affiliations
  • 1School of Material Science and Engineering, Guilin University of Electronic Technology, Guilin 541004, China
  • 2Guangxi Key Laboratory of Electronic Information Materials, Guilin 541004, China
  • 3Engineering Research Center of Ministry of Education for Electronic Information Materials and Devices, Guilin 541004, China
  • 4Guilin Electrical Equipment Scientific Research Institute Co., Ltd., Guilin 541004, China
Published: 2021-11-22 doi: 10.16790/j.cnki.1009-9239.im.2021.11.015
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In order to prepare polyimide (PI) films with high order degree and stable thermomechanical properties, pyromellitic dianhydride (PMDA) monomer was introduced into biphenyltetracarboxylic acid dianhydride-p-phenylenediamine (BPDA-PDA) system, and PI films were prepared by random copolymerization method. The aggregation structure and physical properties of the PI films were analyzed by XRD, TMA, DMA, TGA, prism coupling instrument, and universal testing machine. The results show that different dianhydride composition has a significant effect on the aggregation structure and thermal mechanical properties of PI films. With the increase of PMDA-PDA segment composition, the molecular chain order degree increases, and the molecular chain spacing decreases from 0.469 nm to 0.436 nm. The birefringence value shows an upward trend in the range of 0.18‒0.22. The glass transition temperature (Tg) decreases at first and then increases in the range of 379.86‒439.05℃. The thermal expansion coefficient (CTE) increases at first and then decreases in the range of 0‒7×10-6 K-1. The tensile strength and 5% thermal decomposition temperature (T5%) show a downward trend in the range of 166‒225 MPa and 576.8‒590.4℃, respectively. When the mole fraction of PMDA is 60%, the PI film has excellent comprehensive properties with 0.22 of birefringence, 439.05℃ of Tg, 0.012 5×10-6 K-1 of CTE, 302.5℃ of heat resistance index(THRI) , and 576.8℃ of T5%.

polyimide film  /  aggregate structure  /  coefficient of thermal expansion  /  thermomechanical property
Shihui LI, Chuanguo MA, Peibang DAI, Shuanggui QING. Influence of Dianhydride Composition on Aggregated Structure and Thermomechanical Properties of PI Films[J]. Insulating Materials, 2021 , 54 (11) : 108 -113 . DOI: 10.16790/j.cnki.1009-9239.im.2021.11.015
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.11.015
  • Receive Date：2021-04-02
  • Online Date：2026-03-23
  • Published：2021-11-22
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History
  • Received：2021-04-02
  • Revised：2021-05-08
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Affiliations
    1School of Material Science and Engineering, Guilin University of Electronic Technology, Guilin 541004, China
    2Guangxi Key Laboratory of Electronic Information Materials, Guilin 541004, China
    3Engineering Research Center of Ministry of Education for Electronic Information Materials and Devices, Guilin 541004, China
    4Guilin Electrical Equipment Scientific Research Institute Co., Ltd., Guilin 541004, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.11.015
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