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Preparation and Properties of Quinoline-imidized Transparent Polyimide at Low Temperature
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Cheng MA, Shumei LIU, Jianqing ZHAO, Zhigeng CHEN, Haohao HUANG
Insulating Materials | 2021, 54(11) : 69 - 74
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Insulating Materials | 2021, 54(11): 69-74
• Polyimide Film Special Issue •
Preparation and Properties of Quinoline-imidized Transparent Polyimide at Low Temperature
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Cheng MA, Shumei LIU, Jianqing ZHAO, Zhigeng CHEN, Haohao HUANG
Affiliations
  • College of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China
Published: 2021-11-22 doi: 10.16790/j.cnki.1009-9239.im.2021.11.009
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A polyamide acid was prepared using 4,4′-diamino-2,2′-bistrifluoromethyl benzene (TFMB) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) as raw materials. The azocyclic quinoline (QL) was used to promote its imidization at lower temperature, and the amount of QL, maximum imidization temperature, and curing time were optimized. The imidization degree of polyimide (PI) film was determined by infrared spectroscopy. The results show that when the molar addition of QL is twice that of BPDA, the polyamide acid is only cured for 4 h at 200℃, the imidization degree is more than 99%. After treated at 250℃ for 0.5 h to remove the residual solvent and QL, the thermal stability of the PI is improved greatly, while its light transmittance is basically unchanged. Compared with the PI film imidized at 300℃, the 5% weight loss temperature (T5%), glass transition temperature (Tg), and tensile strength of the PI film whose imidization promoted by QL decrease slightly, but the elongation at break increases, and the light transmittance at 400 nm increases from 4.5% to 34.4%.

polyimide  /  quinoline  /  low-temperature imidization  /  elongation at break  /  light transmittance
Cheng MA, Shumei LIU, Jianqing ZHAO, Zhigeng CHEN, Haohao HUANG. Preparation and Properties of Quinoline-imidized Transparent Polyimide at Low Temperature[J]. Insulating Materials, 2021 , 54 (11) : 69 -74 . DOI: 10.16790/j.cnki.1009-9239.im.2021.11.009
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doi: 10.16790/j.cnki.1009-9239.im.2021.11.009
  • Receive Date：2021-02-05
  • Online Date：2026-03-23
  • Published：2021-11-22
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  • Received：2021-02-05
  • Revised：2021-03-12
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    College of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.11.009
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Citations
表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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