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Research Progress in Thermally Conductive and Insulating Polyimide Films
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Mengyan GAO1, 2, Chang’ou WANG1, 2, Yan JIA1, 2, Lei ZHAI1, Song MO1, Minhui HE1, Lin FAN1, 2
Insulating Materials | 2021, 54(6) : 1 - 9
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Insulating Materials | 2021, 54(6): 1-9
• Special Issue on Thermal Conductive Insulating •
Research Progress in Thermally Conductive and Insulating Polyimide Films
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Mengyan GAO1, 2, Chang’ou WANG1, 2, Yan JIA1, 2, Lei ZHAI1, Song MO1, Minhui HE1, Lin FAN1, 2
Affiliations
  • 1Key Laboratory of Science and Technology on High-tech Polymer Materials, Chinese Academy of Sciences, Beijing 100190, China
  • 2School of Chemical Sciences, University of Chinese Academy of Sciences, Beijing 100049, China
Published: 2021-06-20 doi: 10.16790/j.cnki.1009-9239.im.2021.06.001
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With the development of advanced electronics and high frequency communication technology, polyimide (PI) film faces more and more high thermal conductivity requirements as an important polymer insulating material. The intrinsic thermal conductivity of traditional PI film is smaller, which cannot meet the rapid cooling requirement of electronic components. In recent years, researchers had carried out a lot of researches on thermally conductive PI films and a series of polyimide-based composite films were prepared by adding inorganic thermally conductive fillers. In this paper, we summarized the latest research progress in thermally conductive PI-based insulating films and discussed the relevant thermal conduction behavior. The key factors influencing the thermal conductivity of films, which include fillers types, particle sizes, addition amount, and the interface interaction between fillers and polyimide matrix, were described systematically. In addition, the technical challenges of high performance polyimide-based thermally conductive insulating film materials were summarized and proposed.

polyimide  /  composite film  /  thermal conductivity  /  filler  /  interface interaction
Mengyan GAO, Chang’ou WANG, Yan JIA, Lei ZHAI, Song MO, Minhui HE, Lin FAN. Research Progress in Thermally Conductive and Insulating Polyimide Films[J]. Insulating Materials, 2021 , 54 (6) : 1 -9 . DOI: 10.16790/j.cnki.1009-9239.im.2021.06.001
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.06.001
  • Receive Date：2020-12-15
  • Online Date：2026-03-03
  • Published：2021-06-20
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  • Received：2020-12-15
  • Revised：2021-02-02
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Affiliations
    1Key Laboratory of Science and Technology on High-tech Polymer Materials, Chinese Academy of Sciences, Beijing 100190, China
    2School of Chemical Sciences, University of Chinese Academy of Sciences, Beijing 100049, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.06.001
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小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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