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Research and Application Progress of Thermoplastic Polyimide
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Cunsheng LIU1, Yuwei CHEN1, Jingru CAO1, Jia LIU1, Xiaohua MA1, Yidong LIU1, 2, Yonggang MIN1, 2
Insulating Materials | 2021, 54(4) : 1 - 7
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Insulating Materials | 2021, 54(4): 1-7
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Research and Application Progress of Thermoplastic Polyimide
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Cunsheng LIU1, Yuwei CHEN1, Jingru CAO1, Jia LIU1, Xiaohua MA1, Yidong LIU1, 2, Yonggang MIN1, 2
Affiliations
  • 1School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China
  • 2Dongguan South China Design Innovation Institute, Dongguan 523808, China
Published: 2021-04-20 doi: 10.16790/j.cnki.1009-9239.im.2021.04.001
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Polyimide (PI) has been widely used as a kind of special engineering plastic. However, the further industrialization development of PI is limited due to its poor melting property. Thermoplastic polyimide (TPI) is developed by modifying the thermosetting PI, and its melting property and processability are improved qualitatively compared to thermosetting PI, so that it can be applied to flexible copper clad laminate, 3D printing and other fields. In this paper, the synthetic method, thermal, mechanical, and processing properties of TPI were summarized, and the application of TPI in flexible printed circuit and other important industrial fields were concluded. The future research directions of TPI were proposed.

thermoplastic polyimide  /  synthetic method  /  performance  /  research progress  /  application status
Cunsheng LIU, Yuwei CHEN, Jingru CAO, Jia LIU, Xiaohua MA, Yidong LIU, Yonggang MIN. Research and Application Progress of Thermoplastic Polyimide[J]. Insulating Materials, 2021 , 54 (4) : 1 -7 . DOI: 10.16790/j.cnki.1009-9239.im.2021.04.001
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.04.001
  • Receive Date：2020-05-17
  • Online Date：2026-01-26
  • Published：2021-04-20
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  • Received：2020-05-17
  • Revised：2020-06-20
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    1School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China
    2Dongguan South China Design Innovation Institute, Dongguan 523808, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.04.001
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