Polymer materials such as epoxy resin have hidden dangers of thermal failure and insulation failure during long-term service since its low thermal conductivity. In this study, a high thermal conductive composite insulating material was prepared by filling micron boron nitride and nano alumina with high thermal conductivity and high insulation properties to epoxy resin, and the effect of filling amount and ratio of fillers on the thermal conductivity and insulation properties of composite materials were studied. The results show that when the total filling content is 30% and the mass ratio of micron boron nitride to nano alumina is 3∶1, the thermal conductivity, breakdown time, and imaginary part of complex permittivity (ε″) of the composite materials is 1.182 0 W/(m·K), 31.9 s, and 0.034, respectively, which is improved by 697%, 21.7%, and 406% compared with epoxy resin, respectively. The composite material has good resistance performance under high frequency and high electric field.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |