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Study and Preparation of Epoxy Composite with High Thermal Conductivity
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Jinhong YU, Yapeng CHEN
Insulating Materials | 2021, 54(2) : 14 - 19
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Insulating Materials | 2021, 54(2): 14-19
Special Issue on Thermal Conductive Insulating
Study and Preparation of Epoxy Composite with High Thermal Conductivity
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Jinhong YU, Yapeng CHEN
Affiliations
  • Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
Published: 2021-02-20 doi: 10.16790/j.cnki.1009-9239.im.2021.02.003
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Spherical alumina was introduced in drawing and filtering process of graphene nanosheets to build a binary porous structure of “pea-pod-like” alumina-graphene, and an alumina-graphene binary structure reinforced epoxy resin composite was prepared. Its thermal conductivity was tested, and the mechanism of “pea-pod-like” alumina-graphene binary structure enhancing the thermal conductivity of epoxy resin was analyzed. The results show that the horizontal arranged graphene generates partial orientation transformation under the action of spherical alumina, showing a “pea-pod-like” structure, in which graphene provides an efficient heat transfer channel for epoxy composites in plane and out of plane directions and greatly enhances the thermal conductivity of epoxy composites. The thermal conductivity of “pea-pod-like” binary alumina-graphene reinforced epoxy composite is up to 13.3 W/(m·K) and 33.4 W/(m·K) in plane and out of plane directions, respectively with 12.1% of graphene and 42.4% of alumina loading. The “pea-pod-like” alumina-graphene binary structure has a significant effect in improving the thermal conductivity of epoxy resin, which has potential application prospects in the field of electrical packaging.

thermal conductivity  /  epoxy  /  graphene  /  alumina
Jinhong YU, Yapeng CHEN. Study and Preparation of Epoxy Composite with High Thermal Conductivity[J]. Insulating Materials, 2021 , 54 (2) : 14 -19 . DOI: 10.16790/j.cnki.1009-9239.im.2021.02.003
Year 2021 volume 54 Issue 2
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.02.003
  • Receive Date:2020-07-09
  • Online Date:2026-01-26
  • Published:2021-02-20
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  • Received:2020-07-09
  • Revised:2020-09-02
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    Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.02.003
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
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Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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