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Molecular Dynamics Simulation on Thermal and Mechanical Properties of h-BN Nano-doping Enhanced Epoxy Resin
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Chengjiang WANG, Wenji ZHOU, Zhengyang FAN, Ning ZHAO
Insulating Materials | 2021, 54(1) : 78 - 83
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Insulating Materials | 2021, 54(1): 78-83
• Test and Analysis •
Molecular Dynamics Simulation on Thermal and Mechanical Properties of h-BN Nano-doping Enhanced Epoxy Resin
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Chengjiang WANG, Wenji ZHOU, Zhengyang FAN, Ning ZHAO
Affiliations
  • College of Electrical Engineering and New Energy, China Three Gorges University, Yichang 443002, China
Published: 2021-01-20 doi: 10.16790/j.cnki.1009-9239.im.2021.01.014
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A pure epoxy resin model and an h-BN/EP composite model were established. The thermal, mechanical, and dielectric property of epoxy resin before and after h-BN nano-doping were calculated by molecular dynamics method. And the effect of different h-BN doping content on the properties of epoxy resin was studied. The results show that when the mass fraction of h-BN is 4%-5%, both the thermal conductivity and thermal stability of epoxy resin increase, the rigidity and toughness increase by more than 10%, and the relative dielectric constant reaches the minimum value about 1.236, indicating that the material maintains good dielectric property.

h-BN  /  nano-doping  /  epoxy resin  /  thermal property  /  mechanical property
Chengjiang WANG, Wenji ZHOU, Zhengyang FAN, Ning ZHAO. Molecular Dynamics Simulation on Thermal and Mechanical Properties of h-BN Nano-doping Enhanced Epoxy Resin[J]. Insulating Materials, 2021 , 54 (1) : 78 -83 . DOI: 10.16790/j.cnki.1009-9239.im.2021.01.014
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.01.014
  • Receive Date：2020-03-17
  • Online Date：2026-01-26
  • Published：2021-01-20
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  • Received：2020-03-17
  • Revised：2020-04-18
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    College of Electrical Engineering and New Energy, China Three Gorges University, Yichang 443002, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.01.014
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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