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Molecular Dynamics Simulation on Effect of Compound Curing Agent on Properties of Epoxy Resin System
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Liucheng HAO1, Duanpeng YUAN1, Rui CHEN1, Ziyang ZHANG2, Yushun ZHAO2, Qing XIE3, Bo WANG4, Zhongxiao SONG4
Insulating Materials | 2021, 54(1) : 73 - 77
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Insulating Materials | 2021, 54(1): 73-77
• Test and Analysis •
Molecular Dynamics Simulation on Effect of Compound Curing Agent on Properties of Epoxy Resin System
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Liucheng HAO1, Duanpeng YUAN1, Rui CHEN1, Ziyang ZHANG2, Yushun ZHAO2, Qing XIE3, Bo WANG4, Zhongxiao SONG4
Affiliations
  • 1High Voltage Switchgear Insulating Materials Laboratory of State Grid, Pinggao Group Co., Ltd., Pingdingshan 467001, China
  • 2School of Electrical Engineering and Automation, Hefei University of Technology, Hefei 230009, China
  • 3State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Baoding 071003, China
  • 4State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China
Published: 2021-01-20 doi: 10.16790/j.cnki.1009-9239.im.2021.01.013
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In order to explore the effect of compound anhydride curing agent on the cured product of epoxy resin, we built crosslinking models of methyl tetrahydrophthalic anhydride (MTHPA)/phthalic anhydride (PA) (their compounding ratio was 10:0, 9:1, 7:3, 5:5, 0:10, respectively) and bisphenol A-type glycidyl ether (DGEBA) by molecular dynamics method. The effect of different compounding ratios on the structure, thermal properties, and mechanical properties of the crosslinking epoxy resin with the same crosslinking degree was studied. The results show that when the compounding ratio of MTHPA and PA is 10:0, the free volume proportion of system reaches maximum, and the motion ability of molecular chains is the strongest. When the compounding ratio is 7:3, the comprehensive mechanical properties of system reach the maximum. When the compounding ratio is 9:1 and 7:3, the glass transition temperature of system reaches the highest and the lowest, respectively.

epoxy resin  /  acid anhydride curing agent  /  mechanical properties  /  glass transition temperature  /  molecular simulation
Liucheng HAO, Duanpeng YUAN, Rui CHEN, Ziyang ZHANG, Yushun ZHAO, Qing XIE, Bo WANG, Zhongxiao SONG. Molecular Dynamics Simulation on Effect of Compound Curing Agent on Properties of Epoxy Resin System[J]. Insulating Materials, 2021 , 54 (1) : 73 -77 . DOI: 10.16790/j.cnki.1009-9239.im.2021.01.013
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.01.013
  • Receive Date：2020-03-03
  • Online Date：2026-01-26
  • Published：2021-01-20
Article Data
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History
  • Received：2020-03-03
  • Revised：2020-06-12
Funding
Affiliations
    1High Voltage Switchgear Insulating Materials Laboratory of State Grid, Pinggao Group Co., Ltd., Pingdingshan 467001, China
    2School of Electrical Engineering and Automation, Hefei University of Technology, Hefei 230009, China
    3State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Baoding 071003, China
    4State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.01.013
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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