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Preparation and Properties of Modified Acrylate Adhesive for FPC Base Materials
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Zhuang GAO1, Yahui LIN1, Wenqiu CHEN1, 2, Xueping ZHANG2, Zhenlin LI1, 2, Heping FAN1, 2
Insulating Materials | 2021, 54(1) : 1 - 6
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Insulating Materials | 2021, 54(1): 1-6
• Material Research •
Preparation and Properties of Modified Acrylate Adhesive for FPC Base Materials
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Zhuang GAO1, Yahui LIN1, Wenqiu CHEN1, 2, Xueping ZHANG2, Zhenlin LI1, 2, Heping FAN1, 2
Affiliations
  • 1a.Key Laboratory of Optoelectronic Chemical Materials and Devices, Ministry of Education, Jianghan University; b.School of Chemical and Environmental Engineering, Jianghan University, Wuhan 430056, China
  • 2Haiso Technology Co., Lt, Wuhan 430074, China
Published: 2021-01-20 doi: 10.16790/j.cnki.1009-9239.im.2021.01.001
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Using ethyl acrylate (EA) and butyl acrylate (BA) as soft monomers, methyl methacrylate (MMA), styrene (St), and acrylonitrile as hard monomers, methyl Hydroxyethyl acrylate (HEMA) and methacrylic acid (MAA) as crosslinking monomers, sodium dodecyl sulfate (SDS) as emulsifiers, and ammonium persulfate (APS) as initiators, an acrylate base emulsion was prepared through semi-continuous seed emulsion polymerization. And then a modified acrylate adhesive for FPC was prepared by adding suitable amount of curing agent and vulcanizing agent to emulsion. The optimal formulation of the acrylate base emulsion was obtained by simple variable method and orthogonal experiment, that is as follow: m(soft monomer) : m(hard monomer) : m(crosslinking agent) : m(emulsifiers): m(initiators)= 65:30:4:3:0.3, w(SDS)=2%, w(APS)=0.3%. With this formulation, the peel strength of the encapsulation sample is 0.92 N/mm, the peel strength of the single panel is 2.15 N/mm, and the soldering resistance pass rate is 100%, the moisture absorption rate of the film is 3.11%, which can all meet the performance requirements of adhesivein the FPC substrate.

FPC  /  adhesive  /  acrylate emulsion  /  performance testing
Zhuang GAO, Yahui LIN, Wenqiu CHEN, Xueping ZHANG, Zhenlin LI, Heping FAN. Preparation and Properties of Modified Acrylate Adhesive for FPC Base Materials[J]. Insulating Materials, 2021 , 54 (1) : 1 -6 . DOI: 10.16790/j.cnki.1009-9239.im.2021.01.001
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.01.001
  • Receive Date：2019-10-24
  • Online Date：2026-01-26
  • Published：2021-01-20
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History
  • Received：2019-10-24
  • Revised：2020-02-18
Funding
Affiliations
    1a.Key Laboratory of Optoelectronic Chemical Materials and Devices, Ministry of Education, Jianghan University; b.School of Chemical and Environmental Engineering, Jianghan University, Wuhan 430056, China
    2Haiso Technology Co., Lt, Wuhan 430074, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.01.001
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表12种不同金属材料的力学参数
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Number of
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小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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