收藏切换
Test study on ultrasonic wire saw cutting of reaction bonded silicon carbide
收藏切换
PDF
Hongxia SONG, Guowei ZENG, Shenghao CHAO, Xiaoguang GUO, Zhigang DONG, Yidan WANG
Journal of Mechanical Strength | 2025, 47(9) : 164 - 173
Less
收藏切换
Journal of Mechanical Strength | 2025, 47(9): 164-173
Test study on ultrasonic wire saw cutting of reaction bonded silicon carbide
Full
Hongxia SONG, Guowei ZENG, Shenghao CHAO, Xiaoguang GUO, Zhigang DONG, Yidan WANG
Affiliations
  • State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian 116024, China
Published: 2025-09-15 doi: 10.16579/j.issn.1001.9669.2025.09.015
Outline
收藏切换

Reaction bonded silicon carbide (RB-SiC) is widely used for manufacturing core components in nuclear energy and optics due to its excellent thermal stability, radiation resistance and chemical inertness. However, RB-SiC is highly hard and brittle, making it difficult to ensure processing quality and efficiency with traditional methods. Ultrasonic diamond wire saw cutting technology, as an efficient machining method for hard brittle materials, has been successfully applied in the processing of single crystal Si, single crystal SiC, and other hard brittle materials. However, the cutting test and process research of this technology in RB-SiC materials need to be carried out. To this end, the ultrasonic sawing test of RB-SiC was carried out for the first time. The ultrasonic wire saw cutting RB-SiC platform was built. The surface quality of parallel and vertical ultrasonic vibration directions was compared and analyzed. The effects of ultrasonic amplitude, line speed and feed speed parameters on surface roughness and surface micro-morphology were studied. Results demonstrate ultrasonic sawing has significant advantages in improving surface quality. Increasing the amplitude from 3 μm to 7 μm reduces surface roughness value by 17.4% and decreases the number of surface scratches and pits. Compared to the vertical feed direction, ultrasonic vibration sawing in the parallel feed direction is more effective in improving the surface quality of RB-SiC materials. This study can provide guidance for the research of ultrasonic sawing process of RB-SiC materials.

Ultrasonic sawing  /  Reaction bonded silicon carbide  /  Diamond wire saw  /  Ultrasonic vibration  /  Surface quality
Hongxia SONG, Guowei ZENG, Shenghao CHAO, Xiaoguang GUO, Zhigang DONG, Yidan WANG. Test study on ultrasonic wire saw cutting of reaction bonded silicon carbide[J]. Journal of Mechanical Strength, 2025 , 47 (9) : 164 -173 . DOI: 10.16579/j.issn.1001.9669.2025.09.015
  • National Key Research and Development Program of China(2022YFB3403401)
Year 2025 volume 47 Issue 9
PDF
75
38
Cite this Article
BibTeX
Article Info
doi: 10.16579/j.issn.1001.9669.2025.09.015
  • Receive Date:2025-03-26
  • Online Date:2026-03-20
  • Published:2025-09-15
Article Data
Affiliations
History
  • Received:2025-03-26
Funding
National Key Research and Development Program of China(2022YFB3403401)
Affiliations
    State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian 116024, China

Corresponding:

WANG Yidan, E-mail:
References
Share
https://castjournals.cast.org.cn/joweb/jxqd/EN/10.16579/j.issn.1001.9669.2025.09.015
Share to
QR

Scan QR to access full text

Cite this article
BibTeX
Citations
表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
  • BibTeX
  • EndNote
  • RefWorks
  • TxT