Negative thermal expansion ScF<sub>3</sub> ceramic for electronic packaging applications

Negative thermal expansion ScF₃ ceramic for electronic packaging applications

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Jin Cheng^a^,^b, Hongye Wang^a^,^b, Xinwei Xu^a^,^b, Naichao Chen^a^,^b, Zhan Zeng^a^,^b, Xiaoyu Li^a^,^b, Biao Guo^a^,^b, Binfeng Zhao^a^,^b, Hong Wang^a^,^b^,^*

Journal of Materiomics | 2026, 12(2) : 101126

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Journal of Materiomics | 2026, 12(2): 101126

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Negative thermal expansion ScF₃ ceramic for electronic packaging applications

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Jin Cheng^a^,^b, Hongye Wang^a^,^b, Xinwei Xu^a^,^b, Naichao Chen^a^,^b, Zhan Zeng^a^,^b, Xiaoyu Li^a^,^b, Biao Guo^a^,^b, Binfeng Zhao^a^,^b, Hong Wang^a^,^b^,^*

Affiliations

^aDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, Guangdong, China

^bShenzhen Engineering Research Center for Novel Electronic Information Materials and Devices, Southern University of Science and Technology, Shenzhen, 518055, Guangdong, China

Published: 2026-03-20 doi: 10.1016/j.jmat.2025.101126

Outline

Abstract

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To meet the demands of miniaturization and integration in modern electronic packaging, developing materials with low coefficient of thermal expansion (CTE) is essential to reduce thermal stress and enhance device reliability. In this study, the dense negative thermal expansion ceramic ScF₃ was prepared with a CTE of -8.86 × 10^-6/℃. The ScF₃ ceramic was cold sintered at 150 ^℃, exhibiting a low permittivity of 5.3 and a high quality factor (Q×f) of 14,700 GHz. By incorporating ScF₃ to the hexagonal boron nitride (BN) ceramic, the CTE of ScF₃-BN composite ceramic was adjusted to 3.36 × 10^-6/℃, establishing compatibility with silicon-based chips. And finite element simulations verified that ScF₃-BN composite significantly reduces thermal stress compared to Li₂MoO₄ or Al₂O₃ ceramics. Furthermore, this work demonstrates the potential of cold-sintered ScF₃ to regulate thermal expansion in packaging substrates, paving the way for improved performance in next-generation electronic devices.

Key words

Negative thermal expansion / Electronic packaging / Cold sintering / Microwave

Cite this Article

Jin Cheng, Hongye Wang, Xinwei Xu, Naichao Chen, Zhan Zeng, Xiaoyu Li, Biao Guo, Binfeng Zhao, Hong Wang. Negative thermal expansion ScF₃ ceramic for electronic packaging applications[J]. Journal of Materiomics, 2026 , 12 (2) : 101126 - . DOI: 10.1016/j.jmat.2025.101126

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Funding

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National Natural Science Foundation of China(52361165625)
Shenzhen Science and Technology Program(KQTD20180411143514543; JCYJ20220818 100613029; JSGGZD20220822095603006)
Guangdong Basic and Applied Basic Research Foundation(2024A1515010190)

Appendix

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Year 2026 volume 12 Issue 2

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Article Info

doi: 10.1016/j.jmat.2025.101126

Receive Date：2025-05-08
Online Date：2026-08-13
Published：2026-03-20

Article Data

Affiliations

History

Received：2025-05-08
Revised：2025-07-09
Accepted：2025-08-05

Funding

National Natural Science Foundation of China(52361165625)

Shenzhen Science and Technology Program(KQTD20180411143514543; JCYJ20220818 100613029; JSGGZD20220822095603006)

Guangdong Basic and Applied Basic Research Foundation(2024A1515010190)

Affiliations

^aDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, Guangdong, China

^bShenzhen Engineering Research Center for Novel Electronic Information Materials and Devices, Southern University of Science and Technology, Shenzhen, 518055, Guangdong, China

Corresponding:

^* Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, 518055, Guangdong, China. E-mail address: wangh6@sustech.edu.cn (H. Wang).

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表12种不同金属材料的力学参数

科 Family	属数 Number of genus	种数 Number of species	占总种数比例 Percentage of total species (%)	属 Genus	种数 Number of species	占总种数比例 Percentage of total species (%)
鹅膏菌科Amanitaceae	2	11	5.26	鹅膏菌属 Amanita	10	4.78
小菇科 Mycenaceae	2	12	5.74	丝盖伞属 Inocybe	5	2.39
多孔菌科 Polyporaceae	8	14	6.70	蜡蘑属 Laccaria	5	2.39
红菇科 Russulaceae	3	23	11.00	小皮伞属 Marasmius	6	2.87
				小菇属 Mycena	11	5.26
				光柄菇属 Pluteus	5	2.39
				红菇属 Russula	17	8.13
				栓菌属 Trametes	5	2.39

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