The superior electrical and mechanical properties of flexible electronics enable the breaking of the limitations of traditional electronic devices, and promise wide applications in the fields of bionic electronics, energy monitoring, and medical monitoring. Transfer printing is the mainstream technology for the fabrication of flexible electronics, realizing the processes of picking up electronic devices from the donor substrate and printing them onto the receiver substrate. Transfer printing greatly enriches the fabrication methods of flexible electronics and promotes the development of related industries. However, even with encouraging advantages, current transfer printing processes still face some challenges that cannot be ignored. For example, the preparation process of the stamp is often complex and requires high-precision machining and fine control. In addition, most external excitations cause damage to electronic devices, hindering the further promotion and application of transfer printing technology. To tackle these technical challenges, this paper proposes a load-combination modulation-based transfer printing method. This scheme is proposed to control the loading sequences of rigid pillars on the stamp, modulate the displacement/stress distribution at the stamp/device interface, realize the interface adhesion control, and finally complete the transfer printing on different rigid/flexible substrates. This paper also considers the complex nonlinear relationship between the geometric parameters of the stamp and the energy release rate during the transfer printing process. The related theoretical models and finite element analysis provide valuable insights for the design of actual transfer printing stamps. Physical experiments further validate the effectiveness and reliability of the transfer printing method proposed in this paper. This method not only has high compatibility and adaptability with the morphology of electronic devices and receiver substrates, but also supports large-scale, multi-layer, and multi-time integration of micro-silicon wafers on flexible substrates. Experimental results demonstrate significant application potential and market prospects.