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To address overheating risks in 3D stacked packaged chips caused by increased power consumption，a thermal resistance matrix-based method was proposed for junction temperature prediction，thereby supporting thermal design and management. A DDR3stacked chip was selected as the case study. Instead of relying on traditional experimental measurements，simulation modeling was utilized to obtain thermal characteristic parameters. Through structural analysis of the 3D configuration，a simulation model was developed using Icepak software. A JESD51-2-compliant thermal test environment was designed to characterize the thermal resistance matrix. Junction temperatures of each chip layer under varying conditions were predicted，and the results demonstrate prediction errors of less than 1% compared to simulation results. This method enables efficient thermal characterization and provides valuable insights for thermal management of 3D stacked chips.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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